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Datasheet > SEAM-20-03.0-L-05-1-A-K-TR
SEAM-20-03.0-L-05-1-A-K-TR PDF预览

SEAM-20-03.0-L-05-1-A-K-TR

更新时间： 2024-11-22 10:14:27
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申泰 - SAMTEC /
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1页 362K
描述
Board Stacking Connector

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SEAM-20-03.0-L-05-1-A-K-TR 数据手册

  
F-217  
SEAM–20–02.0–S–10–2–A–K–TR  
SEAM–30–02.0–S–08–2–A–K–TR  
SEAM–30–03.5–S–04–2–A–K–TR  
(1.27 mm) .050"  
SEAM SERIES  
HIGH-SPEED/HIGH-DENSITY OPEN-PIN-FIELD  
Up to 500  
Pins  
Mates with:  
5, 8 and 10 row footprint  
compatible with SamArray®.  
Samples recommended.  
SPECIFICATIONS  
(1.15 mm)  
.045"  
NOMINAL  
WIPE  
SEAF, SEAFP  
For complete specifications and  
recommended PCB layouts see  
www.samtec.com?SEAM  
Standoffs:  
JSO  
Solder  
charges  
Insulator Material:  
Black LCP  
Contact Material:  
Copper Alloy  
Operating Temp Range:  
-55 °C to +125 °C  
Current Rating  
Low  
(7 mm stack height):  
1.8 A per pin  
insertion/  
extraction  
forces  
(10 adjacent pins powered)  
Plating:  
Au or Sn over  
50 µ" (1.27 µm) Ni  
Contact Resistance:  
5.5 mW  
10 YEAR MFG  
HIGH-SPEED CHANNEL PERFORMANCE  
WITH 30 µ" GOLD  
Working Voltage: 240 VAC  
RoHS Compliant: Yes  
Lead-Free Solderable: Yes  
EXTENDED LIFE  
SEAM/SEAF @ 10 mm Mated Stack Height  
PRODUCT  
Rating based on Samtec reference channel.  
For full SI performance data visit Samtec.com  
HIGH MATING  
CYCLES  
34  
or contact SIG@samtec.com  
G
b p s  
RECOGNITIONS  
For complete scope of  
recognitions see  
www.samtec.com/quality  
NO. PINS  
PER ROW  
LEAD  
STYLE  
PLATING  
OPTION  
NO. OF  
ROWS  
SOLDER  
TYPE  
SEAM  
A
K
TR  
FILE NO. E111594  
STANDARDS  
Specify  
LEAD  
STYLE  
from  
–L  
–A  
= 10 µ"  
(0.25 µm)  
Gold on  
= Alignment Pins  
(Required. Arrays  
will not self-center  
on solder pads)  
• PISMO 2  
• VITA 47  
–1  
–04  
=Four Rows  
(–06.5 not  
available)  
–10, –15, –20,  
= Tin/Lead Alloy  
Solder Charge  
–30, –40, –50  
(–10 only available in 04 row)  
(-15 is only available in 4 Row  
with -02.0 lead style and 10  
row with any lead style)  
• VITA 57.1  
contact area,  
Matte Tin on  
solder tail  
chart  
–2  
PROTOCOLS  
–K  
= Lead-Free  
Solder Charge  
–05  
= Polyimide film  
Pick & Place Pad  
• 100 GbE  
=Five Rows  
(–06.5 not  
available)  
–S  
• Fibre Channel  
• Rapid I/O  
• PCI Express®  
• SATA  
= 30 µ"  
NO. OF  
ROWS  
–04  
–05, –06  
–08  
(0.76 µm)  
Gold on  
contact area,  
Matte Tin on  
solder tail  
B
–TR  
=Tape & Reel  
(7.06) .278  
(9.60) .378  
(12.14) .478  
(14.68) .578  
–06  
=Six Rows  
(–06.5 not  
available)  
• InfiniBand™  
DIFFERENTIAL  
–10  
01  
(1.27) .050  
PAIR  
–08  
MATED HEIGHTS  
ARRAY  
COUNT  
(1.27)  
.050  
=Eight Rows  
SEAM SEAF LEAD STYLE  
(1.27)  
.050  
LEAD  
80  
60  
75  
60  
45  
50  
40  
25  
40x8  
40x6  
30x10  
30x8  
30x6  
20x10  
20x8  
20x5  
–05.0 –06.0 –06.5  
STYLE  
B
–10  
7 mm  
8 mm  
8 mm 8.5 mm  
9 mm 9.5 mm  
–02.0  
–03.0  
–03.5  
–06.5  
–07.0  
–09.0  
–11.0  
=Ten Rows  
8.5 mm 9.5 mm 10 mm  
11.5 mm 12.5 mm 13 mm  
12 mm 13 mm 13.5 mm  
14 mm 15 mm 15.5 mm  
16 mm 17 mm 17.5 mm  
PAIR  
ARRAY  
COUNT  
08  
LEAD  
STYLE  
A
125  
100  
100  
50x10  
50x8  
40x10  
No. of positions x (1.27) .050 + (4.98) .196  
(1.02)  
.040  
(4.60) .181  
(5.59) .220  
(6.10) .240  
(9.14) .360  
(9.60) .378  
(11.60) .457  
(13.60) .535  
–02.0  
–03.0  
–03.5  
–06.5  
–07.0  
–09.0  
–11.0  
(1.27)  
.050  
(1.02)  
.040  
Notes:  
A
Patented  
ALSO AVAILABLE  
IPC-A-610F and  
IPC J-STD-001F Class 3  
solder joint.  
(0.86)  
.034  
DIA  
(MOQ Required)  
(1.12)  
.044  
DIA  
(1.27)  
.050  
(0.10)  
.004  
• Up to 560 pins  
Contact Samtec.  
No. of positions x (1.27) .050 + (3.58) .141  
Some sizes, styles and  
options are non-standard,  
non-returnable.  
WWW.SAMTEC.COM  
Due to technical progress, all designs, specifications and components are subject to change without notice.  
1

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