SDI260 / SDI2100
MICRO SURFACE MOUNT SCHOTTKY BRIDGE
CURRENT
2 Amperes
60 / 100 Volts
VOLTAGE
FEATURES
• Plastic package has Underwriters Laboratory
Flammability Classification 94V-O.
0.335(8.51)
0.316(8.05)
Flame Retardant Epoxy Molding Compound.
• Exceeds environmental standards of MIL-S-19500/228
• Low power loss, high efficiency.
• Low forward voltage, high current capability
• High surge capacity.
• Super fast recovery times, high voltage.
• Epitaxial chip construction.
• Ultra thin profile package for space constrained utilization
• Lead free in comply with EU RoHS 2011/65/EU directives.
0.045(1.14)
0.035(0.89)
0.022(0.56)
0.018(0.46)
• Green molding compound as per IEC61249 Std. . (Halogen Free)
MECHANICAL DATA
0.075(1.90)
0.055(1.39)
• Case: Reliable construction utilizing molded plastic technique results in product
• Terminals: Lead solderable per MIL-STD-750, Method 2026
• Polarity: Polarity symbols molded or marking on body
• Weight: 0.011 ounce, 0.4 gram
MAXIMUMRATINGSANDELECTRICALCHARACTERISTICS
Ratings at 25°C ambient temperature unless otherwise specified.Single phase, half wave, 60Hz, Resistive or inductive load.
For capacitive load, derate current by 20%
PARAMETER
SYMBOL
VRRM
SDI260
60
SDI2100
100
UNITS
V
Maximum Recurrent Peak Reverse Voltage
Maximum RMS Voltage
VRMS
VDC
IF(AV)
IFSM
42
60
70
V
V
A
A
Maximum DC Blocking Voltage
Maximum Average Forward Rectified Current
100
2
Peak Forward Surge Current : 8.3ms single half sine-wave
superimposed on rated load (JEDEC method)
per diode
per diode
per diode
50
Maximum Forward Voltage at 2A
VF
IR
0.68
50
0.84
4
V
Maximum DC Reverse Current at Rated DC Blocking Voltage
Typical Junction Capacitance (VR=4V,f=1MHz)
Typical Thermal Resistance per diode
uA
pF
CJ
130
125
(Note 1)
(Note 2)
RJA
RJL
85
31
85
20
OC / W
OC
Operating and Storage Temperature Range
Storage Temperature Range
TJ
-55 to + 150
-55 to + 150
TSTG
OC
NOTES:
1. Mounted on an FR4 PCB, single-sided copper, mini pad.
2. Mounted on an FR4 PCB, single-sided copper, with 48cm2 copper pad area.
January 23,2013-REV.01
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