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SDHH PDF预览

SDHH

更新时间: 2024-01-03 02:26:14
品牌 Logo 应用领域
伯恩斯 - BOURNS 开关拨码开关
页数 文件大小 规格书
2页 153K
描述
Half Pitch SMD DIP Switch

SDHH 数据手册

 浏览型号SDHH的Datasheet PDF文件第2页 
The SDHH Series is currently available,  
although not recommended for new  
designs.  
Features  
Eight and four positions available  
Gold plated contacts offer high reliability  
Low contact resistance  
Just 1.5 mm total height  
Half pitch of 1.27 mm(.050 in.)  
RoHS compliant*  
SDHH Series Half Pitch SMD DIP Switch  
Electrical Characteristics  
Product Dimensions  
SDHH Series Dimensions  
Electrical Life ......1,000 operation cycles  
per switch min.  
A
MODEL NO. ꢁOS.  
DIM. A  
DIM. B  
Non-Switching Rating ..100 mA, 50 VDC  
Switching Rating ............25 mA, 24 VDC  
Contact Resistance.....100 mohms max.  
Insulation Resistance ...100 Mohms min.,  
DC 500 V min.  
SDHH-4  
SDHH-8  
4
8
6.31 (.248)  
11.39 (.448)  
3.81 (.15)  
8.89 (.35)  
ON  
DIꢁ  
How to Order  
Dielectric Strength  
..........................AC 300 V for 1 minute  
Capacitance............................5 pF max.  
between adjacent closed switch  
Circuit ...............Single pole single throw  
SDH H - 8 - T R  
Model  
1 2 3 4 5 6 7 8  
Actuator  
H = Recessed  
Environmental Characteristics  
1.50  
(.006)  
Number of positions  
4 = 4 positions  
8 = 8 positions  
Mechanical Life............1,000 operations  
per switch min.  
Operation Force ....................500 g max.  
Stroke..........................................0.6 mm  
Operating Temp. Range  
..................................-40 °C to +85 °C  
Storage Temperature ...-40 °C to +85 °C  
Vibration Test .................MIL-STD-202F,  
Method 201A  
Seal  
T = Top tap sealed (standard)  
0.10  
(.004)  
Packaging  
R = Tape and reel  
1.27  
0.40  
(.016)  
(.050)  
ꢁITCH  
Reflow Soldering Profile  
Frequency.........10-50-10 Hz/1 minute  
Directions............X,Y,Z, three mutually  
perpendicular directions  
Time.................2 hours each direction,  
high reliability  
Shock Test .....................MIL-STD-202F,  
Method 213B, Condition A  
Gravity ......50 G (peak value), 11 msec  
Direction & Times ..............6 sides and  
3 times in each direction.  
275  
225  
175  
4.50  
(.177)  
240 °C  
180 °C  
10-15  
Sec.  
125  
75  
120 °C  
80-90 Sec.  
35-60  
Sec.  
0.60  
(.024)  
30-40 Sec.  
25  
0
20 40 60 80 100 120 140 160 180 200  
Time (Seconds)  
High reliability  
6.70  
(.264)  
Physical Characteristics  
MM  
(INCHES)  
DIMENSIONS ARE:  
Recommended PCB Layout  
Cover Materials ................Thermoplastic  
Nylon, UL94V-0; black  
Base Materials..................Thermoplastic  
Nylon, UL94V-0; black  
Actuator Materials............Thermoplastic  
LCP, UL94V-0; white  
1.27 x (ꢁ-1)  
[.050 x (ꢁ-1)]  
TOLERANCES: .2 EꢀCEꢁT ꢂHERE NOTED.  
1.27  
(.050)  
ꢁITCH  
Contact Materials...............Alloy Copper  
Contact Plating........3 Micro inches gold  
over 40 micro inches nickel  
Terminal Materials..................Brass with  
Gold plating  
4.90  
(.193)  
6.15  
(.242)  
0.76  
(.030)  
Reflow Soldering .......Peak temperature  
or reflow oven should  
7.40  
(.291)  
be set to 240 ° C. max.  
2 sec. while applying solder  
Packaging........................All poles in the  
“off” position  
Circuit Diagram  
*RoHS Directive 2002/95/EC Jan 27 2003 including Annex.  
Specifications are subject to change without notice.  
Customers should verify actual device performance in their specific applications.  

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