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SCO1500912 PDF预览

SCO1500912

更新时间: 2024-09-21 19:49:35
品牌 Logo 应用领域
思佳讯 - SKYWORKS 电容器
页数 文件大小 规格书
5页 155K
描述
Film Capacitor, Silicon Dioxide And Nitride, 20% +Tol, 20% -Tol, 50ppm/Cel TC, 0.000015uF, Surface Mount, 0101, GREEN

SCO1500912 技术参数

是否Rohs认证: 符合生命周期:Active
包装说明:, 0101Reach Compliance Code:unknown
ECCN代码:EAR99HTS代码:8532.25.00.55
风险等级:5.6电容:0.000015 µF
电容器类型:FILM CAPACITOR介电材料:SILICON DIOXIDE AND NITRIDE
高度:5 mm长度:12 mm
安装特点:SURFACE MOUNT负容差:20%
端子数量:2最高工作温度:200 °C
最低工作温度:-65 °C封装形状:RECTANGULAR PACKAGE
封装形式:SMT包装方法:WAFFLE PACK
正容差:20%系列:SC
尺寸代码:0101表面贴装:YES
温度系数:50ppm/Cel ppm/ °C端子形状:ONE SURFACE
宽度:12 mmBase Number Matches:1

SCO1500912 数据手册

 浏览型号SCO1500912的Datasheet PDF文件第2页浏览型号SCO1500912的Datasheet PDF文件第3页浏览型号SCO1500912的Datasheet PDF文件第4页浏览型号SCO1500912的Datasheet PDF文件第5页 
DATA SHEET  
SC Series: MIS Chip Capacitors  
Applications  
Systems requiring DC blocking or RF bypassing  
Fixed capacitance tuning element in filters, oscillators, and  
matching networks  
Features  
Readily available from stock  
High reliability silicon oxide-nitride dielectric  
Low loss: typically 0.04 dB in a 50 Ω system  
Operation through 26 GHz  
Description  
Skyworks Metal Insulator Silicon (MIS) chip capacitors are  
available in a wide range of sizes and capacitance values. The  
devices have a dielectric composed of thermally grown silicon  
dioxide over which a layer of silicon nitride is deposited. This  
dielectric has a low temperature coefficient of capacitance and  
very high insulation resistance.  
Wide temperature operation  
The MIS chip capacitors also exhibit excellent long-term stability,  
which makes them suitable for high-reliability applications. The  
capacitors have a high dielectric breakdown, which permits the  
use of thin dielectrics resulting in large capacitance per unit area.  
The temperature coefficient is less than 50 ppm/°C, allowing the  
capacitors to operate from 65 °C up to 200 °C. Compared to  
ceramic capacitors, Skyworks MIS chip capacitors offer higher Q  
and an insertion loss of 0.04 dB in a 50 Ω system. Insulation  
resistance is greater than 105 MΩ.  
To accommodate high volume, automated assembly methods,  
wafers can be supplied on expanded film frames. To reduce cost,  
chips can be supplied packaged in vials with sample testing only.  
Packaging in waffle packs with 100 percent electrical testing and  
visual inspection is also available.  
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com  
200136G • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • May 25, 2011  
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