Datasheet > SCGB1005B601FPF

SCGB1005B601FPF

更新时间： 2024-11-22 01:11:11

品牌	Logo	应用领域
硕凯 - SOCAY		/
页数	文件大小	规格书
4页	224K
描述
Chip Ferrite Bead

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SCGB1005B601FPF 数据手册

Chip Ferrite Bead

SCGB1005-B Series

Features

Monolithic inorganic material construction

Closed magnetic circuit avoids crosstalk

SMD Type & suitable for reflow and wave soldering

Available in various sizes

Excellent solderability and heat resistance

High reliability

With a sharp and frequency impedance characteristics

which can effectively filter high frequency noise without

attenuating high frequency signal

Applications

Filtering between analog and digital circuitry, clock generation

circuitry, I/O interconnects, isolation between RF noisy circuits

and logic devices susceptible to functional degradation, power

supply filtering to prevent conducted RF energy from corrupting

the power generation circuitry. Sharp impedance

characteristics can effectively minimize attenuation, high

frequency EMI prevention of LCD monitor, PDA, Computers,

Computer peripherals, Cellular Equipment, Digital TV, Digital

Cameras,

Audio/Visual

Equipment,

DVD,

Wireless

Communication Devices, MP3.

General Technical Data

Operating temperature range

Storage Condition

Storage Time

-40 ~ +125ºC

Less than 40℃ and 70% RH

6 months Max.

Soldering method

Reflow or Wave Soldering

Part Numbering

SCGB

1005

(1)

(2)

(3)

(4) (5) (6) (7) (8)

Series Name

Size Code: the first two digitals : length(mm), the last two digitals : width(mm)

Material Code

Impedance(Ω), ±25%

Fixed Decimal Point

e.g.: 600=60 Ω, 121=120Ω

Rated Current Cod

A=50mA

B=80mA

C=100mA

I=600mA

D=150mA

J=700mA

E=200mA

K=800mA

F=300mA

G=400mA

H=500mA

Packaging: P - Embossed paper tape, 7" reel

T - Embossed plastic tape, 7" reel

Soldering : Green Parts: S - Soldering Lead-Free

F - Lead-Free for whole chip

SOCAY Electronics Co., Ltd.

www.socay.com

@ SOCAY Electronics Co., Ltd. 2014

Specifications are subject to change without notice.

Please refer to www.socay.com for current information.

Revision February 13, 2014

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