Datasheet > SC900841JVK

SC900841JVK

更新时间： 2024-02-07 02:01:11

品牌	Logo	应用领域
恩智浦 - NXP		/
页数	文件大小	规格书
192页	3425K
描述
1-CHANNEL POWER SUPPLY MANAGEMENT CKT, PBGA338, 11 X 11 MM, ROHS COMPLIANT, PLASTIC, MABGA-338

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SC900841JVK 技术参数

是否Rohs认证：	符合	生命周期：	Transferred
零件包装代码：	BGA	包装说明：	TFBGA,
针数：	338	Reach Compliance Code：	not_compliant
ECCN代码：	EAR99	HTS代码：	8542.39.00.01
风险等级：	5.71	可调阈值：	YES
模拟集成电路 - 其他类型：	POWER SUPPLY MANAGEMENT CIRCUIT	JESD-30 代码：	S-PBGA-B338
长度：	11 mm	湿度敏感等级：	3
信道数量：	1	功能数量：	1
端子数量：	338	最高工作温度：	85 °C
最低工作温度：	-40 °C	封装主体材料：	PLASTIC/EPOXY
封装代码：	TFBGA	封装形状：	SQUARE
封装形式：	GRID ARRAY, THIN PROFILE, FINE PITCH	峰值回流温度（摄氏度）：	260
认证状态：	Not Qualified	座面最大高度：	1.2 mm
最大供电电压 (Vsup)：	4.4 V	最小供电电压 (Vsup)：	3 V
标称供电电压 (Vsup)：	3.6 V	表面贴装：	YES
温度等级：	INDUSTRIAL	端子面层：	Tin/Silver/Copper - with Nickel barrier
端子形式：	BALL	端子节距：	0.706 mm
端子位置：	BOTTOM	处于峰值回流温度下的最长时间：	40
宽度：	11 mm	Base Number Matches：	1

SC900841JVK 数据手册

ELECTRICAL CHARACTERISTICS

MAXIMUM RATINGS

ELECTRICAL CHARACTERISTICS

MAXIMUM RATINGS

Table 1. Maximum Ratings

All voltages are with respect to ground, unless otherwise noted. Exceeding these ratings may cause malfunction or permanent

damage to the device. The detailed maximum voltage rating per pin can be found in the pin list section.

Ratings

Symbol

Value

Unit

ELECTRICAL RATINGS

Charger Input Voltage

LCD Backlight Circuitry Voltage

Battery Voltage

-0.3 to +20

-0.3 to +28

-0.3 to +4.4

-0.3 to +3.6

±2000

Coin Cell Voltage

ESD Rating, All Pins, Human Body Model (HBM)⁽³⁾

ESD Rating, All Pins, Charge Device Model (CDM) ^{(3), (4)}

THERMAL RATINGS

V_ESDHBM

V_ESDCDM

±450

Ambient Operating Temperature Range

Operating Junction Temperature Range

Storage Temperature Range

T_A

T_J

-40 to +85

-30 to +125

-65 to +150

260

°C

T_ST

Peak Package Reflow Temperature^{(1), (2)}

T_PPRT

Notes

1. Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may

cause a malfunction or permanent damage to the device.

2. Freescale's Package Reflow capability meets the Pb-free requirements for JEDEC standard J-STD-020C, for Peak Package Reflow

Temperature and Moisture Sensitivity Levels (MSL)

3. ESD testing is performed in accordance with the Human Body Model (HBM) (CZAP = 100 pF, RZAP = 1500 Ω), and the Charge Device

Model (CDM), Robotic (CZAP = 4.0 pF).

4. All pins meet 500 V CDM except VCOREREF.

POWER DISSIPATION

POWER CONSUMPTION

During operation, the temperature of the die must not

exceed the maximum junction temperature. Depending on

the operating ambient temperature and the total internal

dissipation this limit can be exceeded.

Table 2 defines the maximum power consumption

specifications in the various system and device states. For

each entry in the table, the component is assumed to be

configured for driving purely capacitive loads, and the

voltages listed in each entry are nominal output voltages.

To optimize the thermal management scheme and avoid

overheating, the 900841 provides a thermal management

system that protects against overheating. This protection

should be considered as a fail-safe mechanism, and the

application design should initiate thermal shutdown under

normal conditions. Reference Thermal Management for more

details.

Note that the “Soft Mechanical Off” state is a transitional

state. The device will spend less than 150 µs in this state

before V15 starts to turn on, upon detection of a valid USB

device or valid battery.

900841

Analog Integrated Circuit Device Data

Freescale Semiconductor

123 4 5 6 7...192

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