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SC18IS600IBS,157 PDF预览

SC18IS600IBS,157

更新时间: 2024-10-01 15:50:43
品牌 Logo 应用领域
恩智浦 - NXP 时钟外围集成电路
页数 文件大小 规格书
29页 304K
描述
SC18IS600 - SPI to I²C-bus interface QFN 24-Pin

SC18IS600IBS,157 技术参数

是否Rohs认证: 符合生命周期:Obsolete
零件包装代码:QFN包装说明:HVQCCN, LCC24,.16SQ,20
针数:24Reach Compliance Code:compliant
HTS代码:8542.31.00.01风险等级:5.82
地址总线宽度:最大时钟频率:18 MHz
外部数据总线宽度:JESD-30 代码:S-PQCC-N24
JESD-609代码:e4长度:4 mm
湿度敏感等级:1端子数量:24
最高工作温度:85 °C最低工作温度:-40 °C
封装主体材料:PLASTIC/EPOXY封装代码:HVQCCN
封装等效代码:LCC24,.16SQ,20封装形状:SQUARE
封装形式:CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE峰值回流温度(摄氏度):260
电源:2.4/3.6 V认证状态:Not Qualified
座面最大高度:1 mm子类别:Bus Controllers
最大压摆率:16 mA最大供电电压:3.6 V
最小供电电压:2.4 V表面贴装:YES
技术:CMOS温度等级:INDUSTRIAL
端子面层:NICKEL PALLADIUM GOLD端子形式:NO LEAD
端子节距:0.5 mm端子位置:QUAD
处于峰值回流温度下的最长时间:30宽度:4 mm
uPs/uCs/外围集成电路类型:BUS CONTROLLER, I2CBase Number Matches:1

SC18IS600IBS,157 数据手册

 浏览型号SC18IS600IBS,157的Datasheet PDF文件第2页浏览型号SC18IS600IBS,157的Datasheet PDF文件第3页浏览型号SC18IS600IBS,157的Datasheet PDF文件第4页浏览型号SC18IS600IBS,157的Datasheet PDF文件第5页浏览型号SC18IS600IBS,157的Datasheet PDF文件第6页浏览型号SC18IS600IBS,157的Datasheet PDF文件第7页 
SC18IS600  
SPI to I2C-bus interface  
Rev. 6 — 4 May 2012  
Product data sheet  
1. General description  
The SC18IS600 is designed to serve as an interface between the standard SPI of a host  
(microcontroller, microprocessor, chip set, etc.) and the serial I2C-bus. This allows the  
host to communicate directly with other I2C-bus devices. The SC18IS600 can operate as  
an I2C-bus master-transmitter or master-receiver. The SC18IS600 controls all the I2C-bus  
specific sequences, protocol, arbitration and timing.  
2. Features and benefits  
SPI slave interface  
SPI Mode 3  
Single master I2C-bus controller  
Four General Purpose Input/Output (GPIO) pins  
Two quasi-bidirectional I/O pins  
5 V tolerant I/O pins  
High-speed SPI: Up to 1.2 Mbit/s  
High-speed I2C-bus: 400 kbit/s  
96-byte transmit buffer  
96-byte receive buffer  
2.4 V to 3.6 V operation  
Power-down mode with WAKEUP pin  
Internal oscillator  
Active LOW interrupt output  
Available in very small TSSOP16 and HVQFN24 packages  
3. Ordering information  
Table 1.  
Ordering information  
Type number  
Package  
Name  
TSSOP16 plastic thin shrink small outline package; 16 leads; body width 4.4 mm  
Description  
Version  
SC18IS600IPW  
SC18IS600IBS  
SOT403-1  
HVQFN24 plastic thermal enhanced very thin quad flat package; no leads; 24 terminals; SOT616-3  
body 4 × 4 × 0.85 mm  
 
 
 

SC18IS600IBS,157 替代型号

型号 品牌 替代类型 描述 数据表
SC18IS600IBS,128 NXP

完全替代

SC18IS600 - SPI to I²C-bus interface QFN 24-P

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