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SC-9

更新时间: 2023-02-15 00:00:00
品牌 Logo 应用领域
思佳讯 - SKYWORKS /
页数 文件大小 规格书
5页 155K
描述
Film Capacitor, Silicon Dioxide And Nitride, 20% +Tol, 20% -Tol, 50ppm/Cel TC, 0.001uF, Surface Mount, 0707, GREEN

SC-9 数据手册

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DATA SHEET SC SERIES: MIS CHIP CAPACITORS  
Table 1. MIS Capacitors Absolute Maximum Ratings  
Parameter  
Dielectric withstand voltage  
Operating temperature  
Storage temperature  
Symbol  
Minimum  
Typical  
Maximum  
Units  
V
100  
TOP  
65  
65  
+200  
+200  
°C  
TSTG  
°C  
Note: Exposure to maximum rating conditions for extended periods may reduce device reliability. There is no damage to device with only one parameter set at the limit and all other  
parameters set at or below their nominal value.  
CAUTION: Although this device is designed to be as robust as possible, Electrostatic Discharge (ESD) can damage this device. This device  
must be protected at all times from ESD. Static charges may easily produce potentials of several kilovolts on the human body  
or equipment, which can discharge without detection. Industry-standard ESD precautions should be used at all times.  
Table 2. MIS Chip Capacitors Electrical Specifications (Note 1)  
Parameter  
Symbol  
Test Condition  
Min  
Typical  
Max  
Units  
pF  
Capacitance  
0.8  
1000  
Temperature coefficient  
Capacitance tolerance  
Operating temperature  
Dielectric withstand voltage  
Insulation resistance  
Leakage current  
50  
ppm/°C  
%
20  
65  
+20  
TOP  
+200  
°C  
100  
105  
<1  
V
MΩ  
nA  
Note 1: Performance is guaranteed only under the conditions listed in this Table.  
Electrical and Mechanical Specifications  
Performance  
The absolute maximum ratings of the MIS chip capacitors are  
provided in Table 1. Electrical specifications are provided in  
Table 2.  
Tests on typical MIS capacitors at the L and S bands show  
insertion loss to be 1/2 to 1/3 that of equivalent ceramic type  
capacitors, without any of the associated resonance problems.  
Power tests indicate that the only limitation is the actual  
breakdown voltage of the device.  
A graph of typical insertion loss versus frequency is shown in  
Figure 1. This data is taken from an actual test circuit with series  
mounted beam-lead or chip capacitors on a 50 Ω microstrip  
transmission line. The apparent higher loss at lower frequencies  
on the lower capacitance units is strictly due to the capacitive  
reactance of the capacitor.  
Figure 2 illustrates the use of MIS capacitors in a typical Single-  
Pole, Double-Throw (SPDT) circuit.  
Package Dimensions  
Figure 3 provides a visual representation of the capacitor chip  
sizes and part markings.  
Table 3 provides a list of the available MIS chip capacitors (by part  
number) and the capacitance and chip dimensions for each one.  
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com  
May 25, 2011 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • 200136G  
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