是否Rohs认证: | 符合 | 生命周期: | Transferred |
零件包装代码: | BGA | 包装说明: | TFBGA, |
针数: | 338 | Reach Compliance Code: | not_compliant |
ECCN代码: | EAR99 | HTS代码: | 8542.39.00.01 |
风险等级: | 5.71 | 可调阈值: | YES |
模拟集成电路 - 其他类型: | POWER SUPPLY MANAGEMENT CIRCUIT | JESD-30 代码: | S-PBGA-B338 |
长度: | 11 mm | 湿度敏感等级: | 3 |
信道数量: | 1 | 功能数量: | 1 |
端子数量: | 338 | 最高工作温度: | 85 °C |
最低工作温度: | -40 °C | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | TFBGA | 封装形状: | SQUARE |
封装形式: | GRID ARRAY, THIN PROFILE, FINE PITCH | 峰值回流温度(摄氏度): | 260 |
认证状态: | Not Qualified | 座面最大高度: | 1.2 mm |
最大供电电压 (Vsup): | 4.4 V | 最小供电电压 (Vsup): | 3 V |
标称供电电压 (Vsup): | 3.6 V | 表面贴装: | YES |
温度等级: | INDUSTRIAL | 端子面层: | Tin/Silver/Copper - with Nickel barrier |
端子形式: | BALL | 端子节距: | 0.706 mm |
端子位置: | BOTTOM | 处于峰值回流温度下的最长时间: | 40 |
宽度: | 11 mm | Base Number Matches: | 1 |
型号 | 品牌 | 描述 | 获取价格 | 数据表 |
SC900841JVKR2 | NXP | 1-CHANNEL POWER SUPPLY MANAGEMENT CKT, PBGA338, 11 X 11 MM, ROHS COMPLIANT, PLASTIC, MABGA |
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SC900844JVK | FREESCALE | Integrated Power Management IC for Ultra-mobile and Embedded Applications |
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SC900A | SEMTECH | Programmable Penta ULDO with RESET and I2C Interface |
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SC900AEVB | SEMTECH | Programmable Penta ULDO with RESET and I2C Interface |
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SC900AMLTRT | SEMTECH | Programmable Penta ULDO with RESET and I2C Interface |
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SC900CT | SWITCH | 600, 700, 702, 800 & 900 Series Overview |
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