SPICE MODEL: SBR0220LP
SBR0220LP
0.2A SBR®
Super Barrier Rectifier
Features
Mechanical Data
•
•
Case: DFN1006-2
•
•
•
•
•
•
•
Low Leakage Current
Case Material: Molded Plastic, “Green” Molding
compound. UL Flammability Classification Rating
94V-0
Moisture Sensitivity: Level 1 per J-STD-020C
Polarity Indicator: Cathode Dot
Terminals: Finish - NiPdAu annealed over
Copper leadframe. Solderable per MIL-STD-202,
Method 208
Patented Super Barrier Rectifier Technology
Excellent High Temperature Stability
Soft, Fast Switching Capability
150ºC Operating Junction Temperature
Lead Free Finish, RoHS Compliant (Note 1)
“Green” Molding Compound (No Br, Sb)
•
•
•
•
•
•
Marking Information: See Page 3
Ordering Information: See Page 3
Weight: 0.001 grams (Approx.)
Maximum Ratings @ TA = 25ºC unless otherwise specified
Single phase, half wave, 60Hz, resistive or inductive load.
For capacitive load, derate current by 20%.
Characteristic
Symbol
Value
Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
VRRM
VRWM
VRM
20
V
RMS Reverse Voltage
VR(RMS)
IO
14
V
A
Average Rectified Output Current (See Figure 1)
0.2
Non-Repetitive Peak Forward Surge Current 8.3ms
Single Half Sine-Wave Superimposed on Rated Load
IFSM
5.0
A
Maximum Thermal Resistance
Thermal Resistance Junction to Soldering (Note 2)
Thermal Resistance Junction to Ambient (Note 3)
RӨJS
RӨJA
17
304
ºC/W
ºC
Operating and Storage Temperature Range
TJ, TSTG
-65 to +150
Electrical Characteristics @ TA = 25ºC unless otherwise specified
Min
Typ
Max
Unit
Test Condition
IR = 400 µA
Characteristic
Symbol
Reverse Breakdown Voltage (Note 4)
V(BR)R
20
-
-
V
0.38
0.30
0.44
0.38
0.42
0.33
0.48
0.41
IF = 0.1A, TJ = 25ºC
IF = 0.1A, TJ = 150ºC
IF = 0.2A, TJ = 25ºC
IF = 0.2A, TJ = 150ºC
Forward Voltage Drop
VF
-
-
V
2
50
µA
VR = 20V, TJ = 25ºC
VR = 20V, TJ = 150ºC
Leakage Current (Note 4)
IR
0.43
1.3
mA
Notes:
1. RoHS revision 13.2.2003. High temperature solder exemption applied, see EU Directive Annex Note 7.
2. Theoretical RӨJS calculated from the top center of the die straight down to the PCB cathode tab solder junction.
3. FR-4 PCB, 2oz. Copper, minimum recommended pad layout per http://www.diodes.com/datasheets/ap02001.pdf.
4. Short duration pulse test used to minimize self-heating effect.
__________
SBR is a registered trademark of Diodes Incorporated.
SBR0220LP Rev. 3 - 2
1 of 4
www.diodes.com
May 2007
© Diodes Incorporated