Datasheet > SA636BS,115

SA636BS,115

更新时间： 2024-02-13 14:18:29

品牌	Logo	应用领域
恩智浦 - NXP		电信电信集成电路
页数	文件大小	规格书
31页	2053K
描述
SA636 - Low voltage high performance mixer FM IF system with high-speed RSSI QFN 20-Pin

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SA636BS,115 技术参数

Source Url Status Check Date：	2013-06-14 00:00:00	是否Rohs认证：	符合
生命周期：	Active	零件包装代码：	QFN
包装说明：	HVQFN-20	针数：	20
Reach Compliance Code：	compliant	风险等级：	1.65
JESD-30 代码：	S-PQCC-N20	长度：	4 mm
湿度敏感等级：	1	功能数量：	1
端子数量：	20	最高工作温度：	85 °C
最低工作温度：	-40 °C	封装主体材料：	PLASTIC/EPOXY
封装代码：	VQCCN	封装形状：	SQUARE
封装形式：	CHIP CARRIER, VERY THIN PROFILE	峰值回流温度（摄氏度）：	NOT SPECIFIED
座面最大高度：	1 mm	标称供电电压：	3 V
表面贴装：	YES	电信集成电路类型：	TELECOM CIRCUIT
温度等级：	INDUSTRIAL	端子形式：	NO LEAD
端子节距：	0.5 mm	端子位置：	QUAD
处于峰值回流温度下的最长时间：	NOT SPECIFIED	宽度：	4 mm
Base Number Matches：	1

SA636BS,115 数据手册

SA636

NXP Semiconductors

Low voltage high performance mixer FM IF system

17.4 Reflow soldering

Key characteristics in reflow soldering are:

• Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to

higher minimum peak temperatures (see Figure 23) than a SnPb process, thus

reducing the process window

• Solder paste printing issues including smearing, release, and adjusting the process

window for a mix of large and small components on one board

• Reflow temperature profile; this profile includes preheat, reflow (in which the board is

heated to the peak temperature) and cooling down. It is imperative that the peak

temperature is high enough for the solder to make reliable solder joints (a solder paste

characteristic). In addition, the peak temperature must be low enough that the

packages and/or boards are not damaged. The peak temperature of the package

depends on package thickness and volume and is classified in accordance with

Table 10 and 11

Table 10. SnPb eutectic process (from J-STD-020D)

Package thickness (mm) Package reflow temperature (C)

Volume (mm³)

< 350

235

 350

220

< 2.5

 2.5

220

Table 11. Lead-free process (from J-STD-020D)

Package thickness (mm) Package reflow temperature (C)

Volume (mm³)

< 350

260

350 to 2000

> 2000

260

< 1.6

260

250

245

1.6 to 2.5

> 2.5

260

245

250

245

Moisture sensitivity precautions, as indicated on the packing, must be respected at all

times.

Studies have shown that small packages reach higher temperatures during reflow

soldering, see Figure 23.

SA636

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 7 — 16 June 2016

26 of 31

1...23 24 252627 28 29...31

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