Datasheet > SA636BS,115

SA636BS,115

更新时间： 2024-01-26 05:19:30

品牌	Logo	应用领域
恩智浦 - NXP		电信电信集成电路
页数	文件大小	规格书
31页	2053K
描述
SA636 - Low voltage high performance mixer FM IF system with high-speed RSSI QFN 20-Pin

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SA636BS,115 技术参数

Source Url Status Check Date：	2013-06-14 00:00:00	是否Rohs认证：	符合
生命周期：	Active	零件包装代码：	QFN
包装说明：	HVQFN-20	针数：	20
Reach Compliance Code：	compliant	风险等级：	1.65
JESD-30 代码：	S-PQCC-N20	长度：	4 mm
湿度敏感等级：	1	功能数量：	1
端子数量：	20	最高工作温度：	85 °C
最低工作温度：	-40 °C	封装主体材料：	PLASTIC/EPOXY
封装代码：	VQCCN	封装形状：	SQUARE
封装形式：	CHIP CARRIER, VERY THIN PROFILE	峰值回流温度（摄氏度）：	NOT SPECIFIED
座面最大高度：	1 mm	标称供电电压：	3 V
表面贴装：	YES	电信集成电路类型：	TELECOM CIRCUIT
温度等级：	INDUSTRIAL	端子形式：	NO LEAD
端子节距：	0.5 mm	端子位置：	QUAD
处于峰值回流温度下的最长时间：	NOT SPECIFIED	宽度：	4 mm
Base Number Matches：	1

SA636BS,115 数据手册

SA636

NXP Semiconductors

Low voltage high performance mixer FM IF system

17. Soldering of SMD packages

This text provides a very brief insight into a complex technology. A more in-depth account

of soldering ICs can be found in Application Note AN10365 “Surface mount reflow

soldering description”.

17.1 Introduction to soldering

Soldering is one of the most common methods through which packages are attached to

Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both

the mechanical and the electrical connection. There is no single soldering method that is

ideal for all IC packages. Wave soldering is often preferred when through-hole and

Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not

suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high

densities that come with increased miniaturization.

17.2 Wave and reflow soldering

Wave soldering is a joining technology in which the joints are made by solder coming from

a standing wave of liquid solder. The wave soldering process is suitable for the following:

• Through-hole components

• Leaded or leadless SMDs, which are glued to the surface of the printed circuit board

Not all SMDs can be wave soldered. Packages with solder balls, and some leadless

packages which have solder lands underneath the body, cannot be wave soldered. Also,

leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,

due to an increased probability of bridging.

The reflow soldering process involves applying solder paste to a board, followed by

component placement and exposure to a temperature profile. Leaded packages,

packages with solder balls, and leadless packages are all reflow solderable.

Key characteristics in both wave and reflow soldering are:

• Board specifications, including the board finish, solder masks and vias

• Package footprints, including solder thieves and orientation

• The moisture sensitivity level of the packages

• Package placement

• Inspection and repair

• Lead-free soldering versus SnPb soldering

17.3 Wave soldering

Key characteristics in wave soldering are:

• Process issues, such as application of adhesive and flux, clinching of leads, board

transport, the solder wave parameters, and the time during which components are

exposed to the wave

• Solder bath specifications, including temperature and impurities

SA636

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 7 — 16 June 2016

25 of 31

1...22 23 242526 27 28...31

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与SA636BS,115相关器件

型号	品牌	描述	获取价格	数据表
SA636DK	NXP	Low voltage high performance mixer FM IF system with high-speed RSSI	获取价格
SA636DK/01,112	NXP	SA636 - Low voltage high performance mixer FM IF system with high-speed RSSI SSOP2 20-Pin	获取价格
SA636DK/02J	NXP	Telecom Circuit	获取价格
SA636DK01	NXP	Low voltage high performance mixer FM IF system with high-speed RSSI	获取价格
SA636DK02	NXP	Low voltage high performance mixer FM IF system with high-speed RSSI	获取价格
SA636DK-T	NXP	IC SPECIALTY TELECOM CIRCUIT, PDSO20, 4.40 MM, PLASTIC, MO-152, SOT266-1, SSOP-20, Telecom	获取价格

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