Datasheet > S596-10-225-08-001461

S596-10-225-08-001461

更新时间： 2024-01-17 02:49:02

品牌	Logo	应用领域
仕元机械 - MILL-MAX		/
页数	文件大小	规格书
2页	106K
描述
IC Socket, BGA225, 225 Contact(s),

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技术参数
数据手册

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S596-10-225-08-001461 技术参数

生命周期：	Active	Reach Compliance Code：	compliant
ECCN代码：	EAR99	HTS代码：	8536.90.40.00
风险等级：	5.69	其他特性：	LOW PROFILE
联系完成终止：	GOLD (10) OVER NICKEL	设备插槽类型：	IC SOCKET
使用的设备类型：	BGA225	JESD-609代码：	e4
触点数：	225	Base Number Matches：	1

S596-10-225-08-001461 数据手册

浏览型号S596-10-225-08-001461的Datasheet PDF文件第1页

MILL-MAX 0.8mm GRID BGA SOCKET / ADAPTER SYSTEMS

This footprint represents a popular 225 position BGA device. Adapters and sockets are sold

separately, order as:

PCB ADAPTER #: S579-10-225-08-001429 (not solder dipped)

or PCB ADAPTER #: S596-10-225-08-001461 (solder dipped)

BGA ADAPTER #: S599-10-225-08-001429 (not solder dipped)

SOCKET #: S596-11-225-08-001445 (solder dipped only)

Contact the Mill-Max Technical Services Department for other standard footprints.

SOLDER DIPPED

.512 SQUARE

.018

.024 DIA.

.047

(OPTIONAL)

0,8mm

TYP.

.035

TYP.

.054

.141

PCB

ADAPTER

.010 DIA.

.047

.054

BGA

.123

.090

ADAPTER

.010 DIA.

.027 DIA.

.140

MATED

HEIGHT

.025

SOCKET

.047

.024 DIA.

SOLDER DIPPED

(62Sn2Ag36Pb)

SPECIFICATIONS:

Materials:

- Socket contact: Three finger, stamped beryllium

copper alloy 172, HT (Mill-Max type #04); plated 10µ”

gold over 50µ” nickel

- Socket shell and adapter pins: Precision machined

brass alloy; plated 10µ” gold over 100µ” nickel

- Dielectric withstanding voltage: 500 V

RMS

- Capacitance between adjacent contacts: 1 pF max.

- Self inductance per pin: 2 nH max.

- Electrical length: 31 pS

Environmental:

- Operating temperature range: -55 °C to +125 °C

- Insulator material: .047” thick glass-epoxy type FR-4,

rated UL94V-0.

Mechanical:

TCE = 10-13ppm/°C,

= 5.0

BGA adapter/socket systems have withstood the following envi-

ronmental tests without mechanical or electrical failure:

- Damp heat, steady state: 40 °C, 93% rH, 21 days

- Damp heat, cyclic: 25/55 °C, 6 days

- Dry heat: 100°C, 1,000 hours

- Insertion and withdrawal forces (using .010” dia.

polished steel gage pin): Insertion: .36N typ. per pin

Withdrawal: .20N typ. per pin

- Thermal shock: -55 to +125 °C, 5 cycles

- Random vibration: 50 to 500 Hz, 8g, 20 min. per axis

- Shock: 50 g per axis

- Solderability: 235 °C, 2 seconds

- Resistance to soldering heat: 270 °C, 10 seconds

- Resistance to corrosion:

- Insertion force of an actual 225 pin device: 90N

- Durability: 100 cycles

- Coplanarity: <.005”

Electrical:

- Current rating (per pin): 1 A

- Working voltage: 100 V

- Low level contact resistance: 10 mΩ max.

/150 V

max.

RMS

Salt spray: 48 hours

- Insulation resistance @ 500 V

RMS

Sulphur dioxide: 96 hours @ 25 ppm SO , 25 °C, 75% rH

Initial value: 1,000,000 MΩ min.

After climatic tests: 10,000 MΩ min.

Hydrogen sulphide: 96 hours @ 12 ppm H S, 25°C, 75% rH

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