Datasheet > S5970

S5970

更新时间： 2024-01-16 20:50:27

品牌	Logo	应用领域
HAMAMATSU		光电
页数	文件大小	规格书
2页	323K
描述
PIN Photodiode, SURFACE MOUNT PACKAGE-10

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S5970 技术参数

生命周期：	Active	包装说明：	SURFACE MOUNT PACKAGE-10
Reach Compliance Code：	unknown	HTS代码：	8541.40.60.50
风险等级：	5.61	Is Samacsys：	N
配置：	COMMON CATHODE, 4 ELEMENTS	最大暗电源：	10 nA
红外线范围：	YES	功能数量：	1
最高工作温度：	100 °C	最低工作温度：	-40 °C
光电设备类型：	PIN PHOTODIODE	峰值波长：	960 nm
最小反向击穿电压：	30 V	形状：	SQUARE
尺寸：	10 mm	Base Number Matches：	1

S5970 数据手册

P H O T O D I O D E

^{Si PIN pho},^todiode,

S5980 S5981 S5870

Multi-element photodiodes for surface mounting

Features

Applications

Large active area

S5980: 5 × 5 mm

S5981: 10 × 10 mm

S5870: 10 × 10 mm

Laser beam axis alignment

Level meters

Pointing devices, etc.

Chip carrier package suitable for surface mounting

Facilitates automated surface mounting by solder reflow

Thin package: 1.26 mmt

Photo sensitivity: 0.72 A/W (λ=960 nm)

General ratings

ꢀ

Parameter

Symbol

S5980

φ5.0/4 elements

S5980

S5981

Resin coating

S5870

Unit

µm

Window material

Gap between elements

Active area

φ10.0/4 elements

φ10.0/2 elements

Absolute maximum ratings

Parameter

Reverse voltage

Operating temperature

ꢀ

Symbol

VR Max.

Topr

S5981

-40 to +100

-40 to +125

S5870

Unit

°C

Storage temperature

Tstg

ꢀ Electrical and optical characteristics (Ta=25 °C, per 1 element)

S5980

Typ.

S5981

Typ.

320 to 1100

S5870

Parameter

Symbol

Condition

Unit

Max.

Typ.

Max.

Spectral response range

Peak sensitivity

wavelength

320 to 1100

λp

960

Photo sensitivity

Dark current

Te mperature coefficient of I

λ=λp

VR=10 V

0.72

0.3

1.15

0.72

0.6

1.15

0.72

1.15

A/W

times/°C

MHz

CID

V_R=10 V, R_L=50 , -3 dB

Cut-off frequency

Ω

Terminal capacitance

Noise equivalent power

V =10 V, f=1 MHz

1.4 × 10^-14

1.9 × 10^-14

3.5 × 10^-14

NEP VR=10 V, λ=λp

W/Hz^1/2

Note) S5980: For mass production, order unit is 100 pieces.

S5981, S5870: For mass production, order unit is 50 pieces.

Precautions for use

ꢀꢀThe light input window of this product uses soft silicone resin. Avoid touching the window to keep it from grime and damage that

can decrease sensitivity. External force applied to the resin surface may deform or cut off the wires, so do not touch the window

to prevent such troubles.

ꢀꢀUse rosin flux when soldering, to prevent the terminal lead corrosion. Reflow oven temperature should be at 260 °C maximum for 5

seconds maximum time under the conditions that no moisture absorption occurs.

Reflow soldering conditions differ depending on the type of PC board and reflow oven. Carefully check these conditions before use.

ꢀꢀSilicone resin swells when it absorbs organic solvent, so do not use any solvent other than alcohol.

ꢀꢀAvoid unpacking until you actually use this product to prevent the terminals from oxidation and dust deposits or the coated resin

from absorbing moisture.

When the product is stored for 3 months while not unpacked or 24 hours have elapsed after unpacking, perform baking in

nitrogen atmosphere at 150 °C for 3 to 5 hours or at 120 °C for 12 to 15 hours before use.

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