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S29XS256RABBHW300 PDF预览

S29XS256RABBHW300

更新时间: 2024-02-26 01:44:52
品牌 Logo 应用领域
赛普拉斯 - CYPRESS 内存集成电路
页数 文件大小 规格书
71页 2815K
描述
Flash, 16X16, PBGA44, 6.20 X 7.70 MM, LEAD FREE AND HALOGEN FREE, FPBGA-44

S29XS256RABBHW300 技术参数

生命周期:Transferred零件包装代码:BGA
包装说明:VFBGA,针数:44
Reach Compliance Code:unknownECCN代码:EAR99
HTS代码:8542.32.00.51风险等级:5.74
JESD-30 代码:R-PBGA-B44长度:7.7 mm
内存密度:256 bit内存集成电路类型:FLASH
内存宽度:16功能数量:1
端子数量:44字数:16 words
字数代码:16工作模式:ASYNCHRONOUS
最高工作温度:85 °C最低工作温度:-25 °C
组织:16X16封装主体材料:PLASTIC/EPOXY
封装代码:VFBGA封装形状:RECTANGULAR
封装形式:GRID ARRAY, VERY THIN PROFILE, FINE PITCH并行/串行:PARALLEL
编程电压:1.8 V认证状态:Not Qualified
座面最大高度:1 mm最大供电电压 (Vsup):1.95 V
最小供电电压 (Vsup):1.7 V标称供电电压 (Vsup):1.8 V
表面贴装:YES技术:CMOS
温度等级:OTHER端子形式:BALL
端子节距:0.5 mm端子位置:BOTTOM
宽度:6.2 mm

S29XS256RABBHW300 数据手册

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D a t a S h e e t ( A d v a n c e I n f o r m a t i o n )  
Colophon  
The products described in this document are designed, developed and manufactured as contemplated for general use, including without  
limitation, ordinary industrial use, general office use, personal use, and household use, but are not designed, developed and manufactured as  
contemplated (1) for any use that includes fatal risks or dangers that, unless extremely high safety is secured, could have a serious effect to the  
public, and could lead directly to death, personal injury, severe physical damage or other loss (i.e., nuclear reaction control in nuclear facility,  
aircraft flight control, air traffic control, mass transport control, medical life support system, missile launch control in weapon system), or (2) for  
any use where chance of failure is intolerable (i.e., submersible repeater and artificial satellite). Please note that Spansion will not be liable to  
you and/or any third party for any claims or damages arising in connection with above-mentioned uses of the products. Any semiconductor  
devices have an inherent chance of failure. You must protect against injury, damage or loss from such failures by incorporating safety design  
measures into your facility and equipment such as redundancy, fire protection, and prevention of over-current levels and other abnormal  
operating conditions. If any products described in this document represent goods or technologies subject to certain restrictions on export under  
the Foreign Exchange and Foreign Trade Law of Japan, the US Export Administration Regulations or the applicable laws of any other country,  
the prior authorization by the respective government entity will be required for export of those products.  
Trademarks and Notice  
The contents of this document are subject to change without notice. This document may contain information on a Spansion product under  
development by Spansion. Spansion reserves the right to change or discontinue work on any product without notice. The information in this  
document is provided as is without warranty or guarantee of any kind as to its accuracy, completeness, operability, fitness for particular purpose,  
merchantability, non-infringement of third-party rights, or any other warranty, express, implied, or statutory. Spansion assumes no liability for any  
damages of any kind arising out of the use of the information in this document.  
Copyright © 2008-2009 Spansion Inc. All rights reserved. Spansion®, the Spansion Logo, MirrorBit®, MirrorBit® Eclipse, ORNAND,  
ORNAND2, HD-SIM, EcoRAMand combinations thereof, are trademarks of Spansion LLC in the US and other countries. Other names  
used are for informational purposes only and may be trademarks of their respective owners.  
March 10, 2009 S29VS_XS-R_00_04  
S29VS/XS-R MirrorBit® Flash Family  
71  

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