Datasheet > S29GL512S11FHI023

S29GL512S11FHI023

更新时间： 2023-07-15 00:00:00

品牌	Logo	应用领域
赛普拉斯 - CYPRESS		可编程只读存储器电动程控只读存储器电可擦编程只读存储器
页数	文件大小	规格书
99页	3463K
描述
EEPROM Card, 32MX16, 110ns, Parallel, CMOS, PBGA64, FBGA-64

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GL-S MirrorBit^®Eclipse^™Flash

Non-Volatile Memory Family

S29GL01GS 1 Gbit

S29GL512S 512 Mbit

S29GL256S 256 Mbit

S29GL128S 128 Mbit

(128 Mbyte)

(64 Mbyte)

(32 Mbyte)

(16 Mbyte)

CMOS 3.0 Volt Core with Versatile I/O

Data Sheet

General Description

The Spansion^®S29GL01G/512/256/128S are MirrorBit Eclipse flash products fabricated on 65 nm process technology. These

devices offer a fast page access time as fast as 15 ns with a corresponding random access time as fast as 90 ns. They feature

a Write Buffer that allows a maximum of 256 words/512 bytes to be programmed in one operation, resulting in faster effective

programming time than standard programming algorithms. This makes these devices ideal for today’s embedded applications

that require higher density, better performance and lower power consumption.

Distinctive Characteristics

 65 nm MirrorBit Eclipse Technology

 Single supply (V_CC) for read / program / erase (2.7V to 3.6V)

 Versatile I/O Feature

 Status Register, Data Polling, and Ready/Busy pin methods

to determine device status

 Advanced Sector Protection (ASP)

– Volatile and non-volatile protection methods for each sector

– Wide I/O voltage range (V ): 1.65V to V

 Separate 1024-byte One Time Program (OTP) array with two

 x16 data bus

lockable regions

 Asynchronous 32-byte Page read

 Common Flash Interface (CFI) parameter table

 Industrial temperature range (-40°C to +85°C)

 100,000 erase cycles for any sector typical

 20-year data retention typical

 512-byte Programming Buffer

– Programming in Page multiples, up to a maximum of 512 bytes

 Single word and multiple program on same word options

 Sector Erase

 Packaging Options

– Uniform 128-kbyte sectors

– 56-pin TSOP

 Suspend and Resume commands for Program and Erase

– 64-ball LAA Fortified BGA, 13 mm x 11 mm

– 64-ball LAE Fortified BGA, 9 mm x 9 mm

operations

Publication Number S29GL_128S_01GS_00

Revision 05

Issue Date December 14, 2011

This document states the current technical specifications regarding the Spansion product(s) described herein. Spansion Inc. deems the products to have been in sufficient pro-

duction volume such that subsequent versions of this document are not expected to change. However, typographical or specification corrections, or modifications to the valid com-

binations offered may occur.

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