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S29AL016D90WEI029 PDF预览

S29AL016D90WEI029

更新时间: 2024-01-31 09:31:48
品牌 Logo 应用领域
飞索 - SPANSION 内存集成电路
页数 文件大小 规格书
13页 492K
描述
Flash, 1MX16, 90ns, WAFER-45

S29AL016D90WEI029 技术参数

生命周期:Obsolete零件包装代码:WAFER
包装说明:WAFER-45针数:45
Reach Compliance Code:unknownECCN代码:EAR99
HTS代码:8542.32.00.51风险等级:5.69
Is Samacsys:N最长访问时间:90 ns
其他特性:BOTTOM BOOT BLOCK备用内存宽度:8
启动块:BOTTOMJESD-30 代码:R-XUUC-N45
内存密度:16777216 bit内存集成电路类型:FLASH
内存宽度:16功能数量:1
端子数量:45字数:1048576 words
字数代码:1000000工作模式:ASYNCHRONOUS
最高工作温度:85 °C最低工作温度:-40 °C
组织:1MX16封装主体材料:UNSPECIFIED
封装代码:DIE封装形状:RECTANGULAR
封装形式:UNCASED CHIP并行/串行:PARALLEL
编程电压:3 V认证状态:Not Qualified
最大供电电压 (Vsup):3.6 V最小供电电压 (Vsup):2.7 V
标称供电电压 (Vsup):3 V表面贴装:YES
技术:CMOS温度等级:INDUSTRIAL
端子形式:NO LEAD端子位置:UPPER
类型:NOR TYPEBase Number Matches:1

S29AL016D90WEI029 数据手册

 浏览型号S29AL016D90WEI029的Datasheet PDF文件第2页浏览型号S29AL016D90WEI029的Datasheet PDF文件第3页浏览型号S29AL016D90WEI029的Datasheet PDF文件第4页浏览型号S29AL016D90WEI029的Datasheet PDF文件第5页浏览型号S29AL016D90WEI029的Datasheet PDF文件第6页浏览型号S29AL016D90WEI029的Datasheet PDF文件第7页 
S29AL016D Known Good Die  
16 Megabit (2 M x 8-Bit/1 M x 16-Bit)  
CMOS 3.0 Volt-only, Boot Sector Flash Memory  
Supplement  
This product has been retired and is not recommended for designs. Please contact your Spansion representative for  
alternatives. Availability of this document is retained for reference and historical purposes only.  
General Description  
The S29AL016D in Known Good Die (KGD) form is 16 Mbit, 3.0 volt-only Flash memory. Spansion defines  
KGD as standard product in die form, tested for functionality and speed. Spansion KGD products have the  
same reliability and quality as Spansion products in packaged form.  
Distinctive Characteristics  
„ Single power supply operation  
„ Embedded Algorithms  
– 2.7 to 3.6 V for read, program, and erase operations  
– Embedded Erase algorithm automatically preprograms and erases  
the entire chip or any combination of designated sectors  
– Embedded Program algorithm automatically writes and verifies data  
at specified addresses  
„ Manufactured on 200 µm process technology  
„ High performance  
– Access times as fast as 90 ns  
„ Minimum one million write cycle guarantee per sector  
„ Ultra low power consumption (typical values at 5 MHz)  
– 200 nA Automatic Sleep mode current  
– 200 nA standby mode current  
„ Compatibility with JEDEC standards  
– Pinout and software compatible with single-power supply Flash  
– Superior inadvertent write protection  
– 7 mA read current  
„ CFI (Common Flash Interface) compliant  
– 15 mA program/erase current  
– Provides device-specific information to the system, allowing host  
software to easily reconfigure for different Flash devices  
„ Flexible sector architecture  
– One 16 Kbyte, two 8 Kbyte, one 32 Kbyte, and thirty-one 64 Kbyte  
sectors (byte mode)  
„ Data# Polling and toggle bits  
– Provides a software method of detecting program or erase  
operation completion  
– One 8 Kword, two 4 Kword, one 16 Kword, and thirty-one 32 Kword  
sectors (word mode)  
„ Ready/Busy# pin (RY/BY#)  
– Supports full chip erase  
– Provides a hardware method of detecting program or erase cycle  
completion  
„ Sector Protection  
– A hardware method of locking a sector to prevent any program or  
erase operations within that sector  
„ Erase Suspend/Erase Resume  
– Suspends an erase operation to read data from, or program data to,  
a sector that is not being erased, then resumes the erase operation  
– Sectors can be locked in-system or via programming equipment  
Temporary Sector Unprotect feature allows code changes in  
previously locked sectors  
„ Hardware reset pin (RESET#)  
– Hardware method to reset the device to reading array data  
„ Unlock Bypass Program Command  
– Reduces overall programming time when issuing multiple program  
command sequences  
„ 20-year data retention at 125°C  
– Reliable operation for the life of the system  
„ Tested to data sheet specifications at temperature  
„ Top or bottom boot block configurations available  
„ Quality and reliability levels equivalent to standard packaged  
components  
Publication Number S29AL016D_KGD_SP  
Revision 07  
Issue Date March 6, 2009  

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