S1A-L
THRU
S1M-L
M C C
ꢀꢁꢂꢃꢄꢅꢆꢄꢇꢇꢈꢃꢂꢁꢉꢊꢅꢆomponents
20736 Marilla Street Chatsworth
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$ꢉ%ꢒꢅ ꢅ ꢅ ꢓꢔꢍꢔ ꢅ!ꢕꢍ"#ꢌꢎꢌ
TM
Micro Commercial Components
Features
•
Lead Free Finish/Rohs Compliant (Note1) ("P"Suffix designates
Compliant. See ordering information)
For Surface Mount Applications
•
•
•
•
·
1 Amp
Silicon Rectifier
50 to 1000 Volts
Extremely Low Thermal Resistance
Easy Pick And Place
High Temp Soldering: 260°C for 10 Seconds At Terminals
Epoxy meets UL 94 V-0 flammability rating
Moisture Sensitivity Level 1
·
Maximum Ratings
•
•
•
Operating Temperature: -55°C to +150°C
DO-214AA
(SMB) (Lead Frame)
Storage Temperature: -55°C to +150°C
Maximum Thermal Resistance; 30°C/W Junction To Lead
H
MCC
Catalog
Number
Device
Marking
Maximum
Recurrent
Peak Reverse
Voltage
50V
Maximum Maximum
RMS
Voltage
DC
Blocking
Voltage
50V
J
S1A-L
S1B-L
S1D-L
S1G-L
S1J-L
S1K-L
S1M-L
S1A
S1B
S1D
S1G
S1J
35V
70V
100V
200V
100V
200V
140V
280V
420V
560V
700V
400V
600V
400V
600V
A
C
S1K
S1M
800V
1000V
800V
1000V
E
D
B
G
Electrical Characteristics @ 25°C Unless Otherwise Specified
DIMENSIONS
Average Forward
current
IF(AV)
1.0A
TJ = 100°C
INCHES
MIN
MM
MIN
DIM
A
MAX
.095
.083
.008
.02
MAX
2.41
2.10
.20
NOTE
.075
.077
.002
-----
1.91
1.96
.05
B
Peak Forward Surge
Current
IFSM
30A
8.3ms, half sine,
C
D
-----
.76
.51
E
.030
.200
.160
.130
.060
.220
.187
.155
1.52
5.59
4.75
3.94
G
H
5.08
4.06
3.30
Maximum
IFM = 1.0A;
TJ = 25°C*
Instantaneous
Forward Voltage
Maximum DC
Reverse Current At
Rated DC Blocking
Voltage
VF
1.1V
J
SUGGESTED SOLDER
PAD LAYOUT
0.090"
IR
5µA
50µA
TJ = 25°C
TJ = 125°C
Typical Junction
Capacitance
CJ
Trr
12pF
Measured at
1.0MHz, VR=4.0V
0.085”
Maximum Reverse
Recovery Time
IF = 0.5A;IR = 1.0A;
Irr = 0.25A;
2.0µs
0.070”
*Pulse test: Pulse width 300 µsec, Duty cycle 2%
Note: 1. High Temperature Solder Exemptions Applied, see EU Directive Annex 7.
www.mccsemi.com
Revision: A
2011/01/01
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