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S10GL-TP-HF PDF预览

S10GL-TP-HF

更新时间: 2024-11-23 19:58:55
品牌 Logo 应用领域
美微科 - MCC 光电二极管
页数 文件大小 规格书
4页 308K
描述
Rectifier Diode, 1 Phase, 1 Element, 10A, 400V V(RRM), Silicon, DO-214AB, SMC, 2 PIN

S10GL-TP-HF 技术参数

是否Rohs认证: 符合生命周期:Active
包装说明:SMC, 2 PINReach Compliance Code:not_compliant
ECCN代码:EAR99HTS代码:8541.10.00.80
风险等级:5.31应用:GENERAL PURPOSE
配置:SINGLE二极管元件材料:SILICON
二极管类型:RECTIFIER DIODE最大正向电压 (VF):1.2 V
JEDEC-95代码:DO-214ABJESD-30 代码:R-PDSO-C2
JESD-609代码:e3湿度敏感等级:1
最大非重复峰值正向电流:200 A元件数量:1
相数:1端子数量:2
最高工作温度:150 °C最低工作温度:-55 °C
最大输出电流:10 A封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
峰值回流温度(摄氏度):260最大重复峰值反向电压:400 V
最大反向电流:10 µA表面贴装:YES
端子面层:Tin (Sn)端子形式:C BEND
端子位置:DUAL处于峰值回流温度下的最长时间:10
Base Number Matches:1

S10GL-TP-HF 数据手册

 浏览型号S10GL-TP-HF的Datasheet PDF文件第2页浏览型号S10GL-TP-HF的Datasheet PDF文件第3页浏览型号S10GL-TP-HF的Datasheet PDF文件第4页 
M C C  
TM  
S10AL  
THRU  
S10ML  
Micro Commercial Components  
ꢀꢁꢂꢃꢄꢅꢆꢄꢇꢇꢈꢃꢂꢁꢉꢊꢅꢆomponents  
20736 Marilla Street Chatsworth  
ꢆꢋꢅꢌꢍꢎꢍꢍ  
ꢏꢐꢄꢑꢈꢒꢅꢓꢔꢍꢔ ꢅ!ꢕꢍ"#ꢌꢎꢎ  
$ꢉ%ꢒꢅ   ꢓꢔꢍꢔ ꢅ!ꢕꢍ"#ꢌꢎꢌ  
10 Amp Surface Mount  
Features  
Lead Free Finish/Rohs Compliant (Note1) ("P"Suffix designates  
Glass Passivated  
Compliant. See ordering information)  
ꢀꢁ Glass Passivated Chip  
Rectifier  
ꢀꢁ High Temp Soldering: 260C for 10 Seconds At Terminals  
50 - 1000 Volts  
·
Epoxy meets UL 94 V-0 flammability rating  
Moisture Sensitivity Level 1  
·
ꢀꢁ Maximum Thermal Resistance; 18C/W Junction To Lead  
Halogen free available upon request by adding suffix "-HF"  
SMC (DO-214AB)  
Maximum Ratings  
G
ꢀꢁ Operating Temperature: -55C to +150C  
ꢀꢁ Storage Temperature: -55C to +150C  
MCC  
Part  
Maximum  
Recurrent  
Maximum  
RMS  
Maximum  
DC  
H
Device  
Number  
Marking Peak Reverse  
Voltage  
Blocking  
Voltage  
50V  
Voltage  
D
S10AL  
S10BL  
S10DL  
S10GL  
S10JL  
S10KL  
S10ML  
S10AL  
S10BL  
S10DL  
S10GL  
S10JL  
S10KL  
S10ML  
50V  
100V  
200V  
400V  
600V  
800V  
1000V  
35V  
70V  
140V  
280V  
420V  
560V  
700V  
C
100V  
A
200V  
E
400V  
B
600V  
800V  
F
DIMENSIONS  
1000V  
INCHES  
MIN  
MM  
MIN  
DIM  
A
MAX  
.103  
.128  
.008  
.012  
.060  
.320  
MAX  
2.62  
NOTE  
.079  
.108  
2.00  
2.75  
B
3.25  
C
.002  
0.051  
0.152  
0.76  
7.75  
6.60  
0.203  
0.305  
1.52  
8.13  
D
.006  
.030  
Electrical Characteristics @ 25C Unless Otherwise Specified  
Average Forward  
Current  
Peak Forward Surge  
Current  
Maximum  
Instantaneous  
Forward Voltage  
Maximum DC  
Reverse Current At  
Rated DC Blocking  
Voltage  
E
F
..305  
.260  
IF(AV)  
10.0A  
TC = 75C  
G
H
.280  
.245  
7.11  
6.22  
.220  
5.59  
IFSM  
200A  
8.3ms, half sine  
IFM = 10.0A;  
TJ = 25C*  
VF  
IR  
1.20V  
SUGGESTED SOLDER  
PAD LAYOUT  
0.190  
10A  
TJ = 25C  
0.125”  
*Pulse test: Pulse width 200 sec, Duty cycle 2%  
Note: 1. High Temperature Solder Exemptions Applied, see EU Directive Annex 7.  
0.070”  
www.mccsemi.com  
1 of 4  
Revision: D  
2014/03/07  

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