Ultrafast Power Rectifier
6 A, 600 V
RURD660S9A-F085
The RURD660S9A−F085 is an ultrafast diode with soft recovery
characteristics (trr < 83 ns). It has a low forward voltage drop and is of
silicon nitride passivated ion−implanted epitaxial planar construction.
This device is intended for use as a freewheeling/clamping diode and
rectifier in a variety of switching power supplies and other power
switching applications. Its low stored charge and ultrafast soft
recovery minimize ringing and electrical noise in many power
switching circuits, thus reducing powerloss in the switching
transistors.
www.onsemi.com
1, 2, 4. Cathode
3. Anode
Features
• High Speed Switching (t = 63 ns (Typ.) @ I = 6 A)
4
rr
F
• Low Forward Voltage (V = 1.26 V (Typ.) @ I = 6 A)
F
F
• Avalanche Energy Rated
• AEC−Q101 Qualified and PPAP Capable
• This is a Pb−Free Device
2
3
1
DPAK3 (TO−252 3 LD)
Applications
CASE 369AS
• General Purpose
• Switching Mode Power Supply
• Power Switching Circuits
MARKING DIAGRAM
$Y&Z&3&K
RUR660
ABSOLUTE MAXIMUM RATINGS (T = 25°C unless otherwise noted)
C
Symbol
Parameter
Ratings
600
Unit
V
V
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
RRM
RWM
RUR660 = Specific Device Code
V
600
V
$Y
&Z
&3
&K
= ON Semiconductor Logo
= Assembly Plant Code
= 3−Digit Date Code
V
R
600
V
I
Average Rectified Forward Current
6
A
F(AV)
@ T = 25°C
= 2−Digits Lot Run Traceability Code
C
I
Non−repetitive Peak Surge Current
60
A
FSM
ORDERING INFORMATION
See detailed ordering and shipping information on page 4 of
this data sheet.
T , T
Operating Junction and Storage
Temperature
− 55 to +175
°C
J
STG
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
THERMAL CHARACTERISTICS (T = 25°C unless otherwise noted)
C
Symbol
Parameter
Max
Unit
R
Maximum Thermal Resistance,
Junction to Case
3
°C/W
q
JC
R
Maximum Thermal Resistance,
140
50
°C/W
°C/W
q
JA
(Note 1) Junction to Ambient
R
Maximum Thermal Resistance,
(Note 2) Junction to Ambient
q
JA
1. Mounted on a minimum pad follow by JEDEC standard.
2
2. Mounted on a 1 in pad of 2 oz copper follow by JEDEC standard.
© Semiconductor Components Industries, LLC, 2013
1
Publication Order Number:
July, 2020 − Rev. 4
RURD660S9A−F085/D