RT9611A/B
maximum power dissipation at TA = 25°C can be calculated
Layout Consideration
by the following formulas :
Figure 6 shows the schematic circuit of a synchronous
buck converter to implement the RT9611A/B. The
converter operates from 5V to 12V of input Voltage.
PD(MAX) = (125°C − 25°C) / (120°C/W) = 0.833W for
SOP-8 package
L1
12V
PD(MAX) = (125°C − 25°C) / (75°C/W) = 1.333W for
SOP-8 (Exposed Pad) package
V
12V
IN
C2
1
C1
R1
C4
BOOT
4
2
VCC
PD(MAX) = (125°C − 25°C) / (70°C/W) = 1.429W for
WDFN-8EL 3x3 package
CB
RT9611A/B
8
7
Q1
UGATE
PWM
PWM
5V
L2
The maximum power dissipation depends on the operating
ambient temperature for fixed TJ(MAX) and thermal
resistance, θJA. The derating curves in Figure 5 allow the
designer to see the effect of rising ambient temperature
on the maximum power dissipation.
V
CORE
PHASE
LGATE
3
6
PHB83N03LT
PHB95N03LT
OD
C3
GND
5
Q2
Figure 6. Synchronous Buck Converter Circuit
1.5
1.4
Four-Layer PCB
1.3
1.2
When layout the PCB, it should be very careful. The power
circuit section is the most critical one. If not configured
properly, it will generate a large amount of EMI. The
junction of Q1, Q2, L2 should be very close.
SOP-8 (Exposed Pad)
1.1
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
SOP-8
WDFN-8EL 3x3
Next, the trace from UGATE, and LGATE should also be
short to decrease the noise of the driver output signals.
PHASE signals from the junction of the power MOSFET,
carrying the large gate drive current pulses, should be as
heavy as the gate drive trace. The bypass capacitor C4
should be connected to GND directly. Furthermore, the
bootstrap capacitors (CB) should always be placed as close
to the pins of the IC as possible.
0
25
50
75
100
125
Ambient Temperature (°C)
Figure 5.Derating Curve of Maximum PowerDissipation
Copyright 2012 Richtek Technology Corporation. All rights reserved.
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is a registered trademark of Richtek Technology Corporation.
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12
DS9611A/B-03 June 2012