CURRENT 1.0 Ampere
VOLTAGE 50 to 800 Volts
RS1A THRU RS1K
Features
· For surface mounted applications in order optimize
board space
· Low profile package
DO-214AC (SMA)
· Built-in strain relief, ideal for automated placement
· Fast switching speed
· Plastic package has Unerwrites Laboratory
Flammability Classification 94V-0
· Low forward voltage drop
0.058(1.47)
0.052(1.32)
0.110(2.79)
0.100(2.54)
· Glass passivated chip junction
· High temperature soldering : 250℃/10 seconds,
at terminals
0.177(4.50)
0.157(3.99)
0.012(0.31)
0.006(0.15)
0.090(2.29)
0.078(1.98)
Mechanical Data
0.005(0.127)
MAX.
0.060(1.52)
0.030(0.76)
· Case : JEDEC SMA(DO-214AC) molded plastic body
· Terminals : Solder plated solderable per
MIL-STD-750, method 2026
· Polarity : Color band denotes cathode end
· Mounting Position : Any
· Weight : 0.002 ounce, 0.064 gram
0.208(5.28)
0.194(4.93)
Dimensions in inches and (millimeters)
Maximum Ratings And Electrical Characteristics
(Ratings at 25℃ ambient temperature unless otherwise specified, Single phase, half wave 60Hz, resistive or inductive
load. For capacitive load, derate by 20%)
Symbols
RS1A
RS1B
RS1D
RS1G
RS1J
RS1K
Units
Maximum recurrent peak reverse voltage
Maximum RMS voltage
V
RRM
RMS
50
35
50
100
70
200
140
200
400
280
400
600
420
600
800
560
800
Volts
Volts
Volts
V
Maximum DC blocking voltage
V
DC
100
Maximum average forward rectified current
at TL=90℃
I
(AV)
1.0
Amp
Amps
Volts
μA
Peak forward surge current 8.3ms single
half sine-wave superimposed on rated load
(JEDEC method) at TL=90℃
IFSM
30.0
1.30
Maximum instantaneous forward voltage
at 1.0A
VF
T
A
A
=25℃
5.0
50
Maximum DC reverse current
at rated DC blocking voltage
IR
T
=125℃
trr
Maximum reverse recovery time (Note 1)
Typical thermal resistance (Note 3)
Typical junction capacitance (Note 2)
150
250
500
7.0
ns
RθJL
RθJA
35.0
105.0
℃/W
C
J
10.0
-55 to +150
pF
T
J
Operating junction and storage
temperature range
℃
T
STG
Notes:
(1) Test conditions: I
F=0.5A, IR=1.0A, Irr=0.25A.
(2) Measured at 1MHz and applied reverse voltage of 4.0 Volts.
(3) Thermal resistance from junction to ambient and from junction to lead mounted on PCB mounted on
0.2×0.2"(5.0×5.0mm) copper pad areas