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RN1973CT(TE85L,F) PDF预览

RN1973CT(TE85L,F)

更新时间: 2024-01-10 08:49:33
品牌 Logo 应用领域
东芝 - TOSHIBA 晶体管
页数 文件大小 规格书
6页 176K
描述
PRE-BIASED "DIGITAL" TRANSISTOR,20V V(BR)CEO,50MA I(C),LLCC

RN1973CT(TE85L,F) 技术参数

是否Rohs认证: 符合生命周期:Active
包装说明:,Reach Compliance Code:unknown
风险等级:5.8最大集电极电流 (IC):0.05 A
最小直流电流增益 (hFE):300元件数量:2
极性/信道类型:NPN最大功率耗散 (Abs):0.14 W
子类别:BIP General Purpose Small Signals表面贴装:YES
晶体管元件材料:SILICONBase Number Matches:1

RN1973CT(TE85L,F) 数据手册

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RN1972CT,RN1973CT  
TOSHIBA Transistor Silicon PNP Epitaxial Type (PCT process) (Bias Resistor built-in Transistor)  
RN1972CT,RN1973CT  
Switching, Inverter Circuit, Interface Circuit and  
Unit: mm  
Driver Circuit Applications  
1.0±0.05  
0.15±0.03  
Two devices are incorporated into a fine pitch Small Mold (6 pin)  
package.  
Incorporating a bias resistor into a transistor reduces parts count.  
Reducing the parts count enable the manufacture of ever more  
compact equipment and save assembly cost.  
0.35±0.02  
0.35±0.02  
0.075±0.03  
0.7±0.03  
Complementary to RN2972CT, RN2973CT  
Equivalent Circuit  
1.EMITTER1  
2.EMITTER2  
3.BASE2  
4.COLLECTOR2  
5.BASE1  
C
CST6  
6.COLLECTOR1  
R1  
JEDEC  
JEITA  
B
TOSHIBA  
2-1K1A  
E
Weight: 1.0 mg (typ.)  
Absolute Maximum Ratings (Ta = 25°C) (Q1, Q2 Common)  
Equivalent Circuit  
(top view)  
Characteristics  
Collector-base voltage  
Symbol  
Rating  
Unit  
6
5
4
V
CBO  
V
CEO  
V
EBO  
20  
V
V
Q2  
Q1  
Collector-emitter voltage  
Emitter-base voltage  
20  
5
50  
V
1
2
3
Collector current  
I
mA  
mW  
°C  
°C  
C
Collector power dissipation  
Junction temperature  
Storage temperature range  
P
140  
C(Note 1)  
T
j
150  
T
stg  
55 to 150  
Note 1: Total rating  
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the  
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if  
the operating conditions (i.e.operatingtemperature/current/voltage, etc.) are within the absolute maximum  
ratings.  
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook  
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test  
report and estimated failure rate, etc).  
1
2009-05-11  

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