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RK80532PC060512/SL6EB PDF预览

RK80532PC060512/SL6EB

更新时间: 2024-02-22 13:45:29
品牌 Logo 应用领域
英特尔 - INTEL 外围集成电路
页数 文件大小 规格书
85页 1750K
描述
RISC Microprocessor, 32-Bit, 2500MHz, CMOS, CPGA478

RK80532PC060512/SL6EB 技术参数

是否Rohs认证: 符合生命周期:Obsolete
包装说明:SPGA, PGA478,26X26,50Reach Compliance Code:unknown
风险等级:5.84位大小:32
JESD-30 代码:S-XPGA-P478端子数量:478
封装主体材料:CERAMIC封装代码:SPGA
封装等效代码:PGA478,26X26,50封装形状:SQUARE
封装形式:GRID ARRAY, SHRINK PITCH电源:1.5 V
认证状态:Not Qualified速度:2500 MHz
子类别:Microprocessors标称供电电压:1.5 V
表面贴装:NO技术:CMOS
端子形式:PIN/PEG端子节距:1.27 mm
端子位置:PERPENDICULARuPs/uCs/外围集成电路类型:MICROPROCESSOR, RISC
Base Number Matches:1

RK80532PC060512/SL6EB 数据手册

 浏览型号RK80532PC060512/SL6EB的Datasheet PDF文件第2页浏览型号RK80532PC060512/SL6EB的Datasheet PDF文件第3页浏览型号RK80532PC060512/SL6EB的Datasheet PDF文件第4页浏览型号RK80532PC060512/SL6EB的Datasheet PDF文件第6页浏览型号RK80532PC060512/SL6EB的Datasheet PDF文件第7页浏览型号RK80532PC060512/SL6EB的Datasheet PDF文件第8页 
Figures  
2-1  
2-2  
2-3  
2-4  
VCCVID Pin Voltage and Current Requirements.................................................17  
Typical VCCIOPLL, VCCA and VSSA Power Distribution ..................................19  
Phase Lock Loop (PLL) Filter Requirements ......................................................19  
V
CC Static and Transient Tolerance (For Intel® Pentium® 4  
Processor With 512-KB L2 Cache on 0.13 Micron Process)...............................29  
V
CC Static and Transient Tolerance (For Intel® Pentium® 4  
2-5  
Processor Extreme Edition Supporting Hyper-Threading Technology)...............31  
ITPCLKOUT[1:0] Output Buffer Diagram ............................................................34  
Test Circuit ..........................................................................................................35  
Exploded View of Processor Components on a System Board ..........................37  
Processor Package .............................................................................................38  
Processor Cross-Section and Keep-In................................................................39  
Processor Pin Detail............................................................................................39  
IHS Flatness Specification ..................................................................................40  
Processor Markings (Processors with Fixed VID)...............................................42  
Processor Markings (Processors with Multiple VID) ...........................................42  
The Coordinates of the Processor Pins As Viewed from the Top  
2-6  
2-7  
3-1  
3-2  
3-3  
3-4  
3-5  
3-6  
3-7  
3-8  
of the Package ....................................................................................................43  
Example Thermal Solution (Not to Scale) ...........................................................67  
Guideline Locations for Case Temperature (TC) Thermocouple Placement ......70  
Stop Clock State Machine...................................................................................72  
Mechanical Representation of the Boxed Processor ..........................................77  
Side View Space Requirements for the Boxed Processor ..................................78  
Top View Space Requirements for the Boxed Processor ...................................79  
Boxed Processor Fan Heatsink Power Cable Connector Description.................80  
MotherBoard Power Header Placement Relative to Processor Socket ..............81  
Boxed Processor Fan Heatsink Airspace Keep-Out Requirements  
5-1  
5-2  
6-1  
7-1  
7-2  
7-3  
7-4  
7-5  
7-6  
(Side 1 View).......................................................................................................82  
Boxed Processor Fan Heatsink Airspace Keep-Out Requirements  
7-7  
7-8  
(Side 2 View).......................................................................................................83  
Boxed Processor Fan Heatsink Set Points .........................................................83  
Intel® Pentium® 4 Processor on 0.13 Micron Process Datasheet  
5

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