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RJ45-8Z3 PDF预览

RJ45-8Z3

更新时间: 2024-02-07 22:29:11
品牌 Logo 应用领域
泰科 - TE PC连接器
页数 文件大小 规格书
6页 285K
描述
Filtered Modular Jacks with Enhanced Performance

RJ45-8Z3 技术参数

是否Rohs认证: 符合生命周期:Obsolete
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8536.69.40.30Factory Lead Time:21 weeks
风险等级:7.96其他特性:LOW PROFILE, SHIELDED
板上安装选件:SPLIT BOARD LOCK主体宽度:0.515 inch
主体深度:0.74 inch主体长度:0.99 inch
主体/外壳类型:JACK连接器类型:TELECOM AND DATACOM CONNECTOR
联系完成配合:NOT SPECIFIED触点性别:MALE
触点材料:NOT SPECIFIED触点电阻:30 m Ω
触点样式:TELCOM, MODULAR介电耐压:1000VAC V
绝缘体颜色:BLACK绝缘体材料:GLASS FILLED POLYESTER
安装选项1:LOCKING安装方式:RIGHT ANGLE
安装类型:BOARD; CABLE; PANEL端口数量:1
PCB接触模式:STAGGERED电镀厚度:50u inch
参考标准:CSA, UL可靠性:COMMERCIAL
外壳面层:TIN外壳材料:PHOSPHOR BRONZE
子类别:Telecom and Datacom Connectors端子长度:0.135 inch
端子节距:2.54 mm端接类型:SOLDER
触点总数:8Base Number Matches:1

RJ45-8Z3 数据手册

 浏览型号RJ45-8Z3的Datasheet PDF文件第2页浏览型号RJ45-8Z3的Datasheet PDF文件第3页浏览型号RJ45-8Z3的Datasheet PDF文件第4页浏览型号RJ45-8Z3的Datasheet PDF文件第5页浏览型号RJ45-8Z3的Datasheet PDF文件第6页 
Catalog: 1654001  
Issue Date: 06.2011  
Corcom Product Guide  
Filtered Modular Jacks with Enhanced Performance  
LC Series  
UL Recognized  
CSA Certified  
Shield 2  
RJ45  
Shield 2  
RJ11  
Shield 1  
RJ11  
Shield 1  
RJ45  
LC Series  
Specifications  
Contacts:  
Material:  
• Chip capacitors provide enhanced filtering  
performance on each line  
Phosphor Bronze  
Plating:  
50 microinches gold  
Barrier underplating:  
Resistance:  
Initial:  
100 microinches nickel  
• Available with block or sleeve inductance  
• Available with board grounded shield or  
spring fingered panel ground interface  
20 mmax.  
30 mmax.  
After 500 mating cycles:  
Capacitors:  
Type:  
Monolithic ceramic chip  
Standard Value:  
Standard Tolerance:  
820 pF  
20ꢀ  
Performance Data  
Ferrites:  
Type:  
High resistivity, nickel zinc ceramic  
Single-aperture cylinders  
Multi-aperture rectangular prism  
Sleeves:  
Block:  
Typical Insertion Loss  
  
Shield Material:  
Tin-plated copper alloy  
  
Housing Material:  
Glass-filled polyester (UL94V-0)  
  
        
     
  
  
  
  
      
Dielectric Withstanding Voltage:  
Line to Line and Line to Ground:  
1000 VAC for  
60 seconds  
  
  
  
  
  
  
  
  
  
  
Printed Circuit Board Retention:  
Before soldering:  
After soldering:  
1 lb. minimum  
20 lb. minimum  
  
  
6
  
  
  
  
  
  
  
  
   
Available Part Numbers  
       
    
  
  
  
  
RJ11-2LC1-S  
RJ11-2LC1-B  
RJ11-2LC2-S  
RJ11-2LC2-B  
RJ11-4LC1-S  
RJ11-4LC1-B  
RJ11-4LC2-S  
RJ11-4LC2-B  
RJ11-6LC1-S  
RJ11-6LC1-B  
RJ11-6LC2-S  
RJ11-6LC2-B  
  
RJ45-6LC1-S  
RJ45-6LC1-B  
RJ45-6LC2-S  
RJ45-6LC2-B  
RJ45-8LC1-S  
RJ45-8LC1-B  
RJ45-8LC2-S  
RJ45-8LC2-B  
Model dimensions and PC board layout on pages 255-259  
249  
Dimensions are in inches and millimeters unless otherwise specified. Values in italics  
are metric equivalents. Dimensions are shown for reference purposes only.  
Specifications subject to change.  
For email, phone or live chat, please go to  
te.com/help  
corcom.com  

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