RH1965MK DICE/DWF
electrical characteristics
Note 8: GND pin current is tested with V = V
+ 1V and a
overtemperature protection is active. Continuous operation above the
specified maximum operating junction temperature may impair device
reliability.
Note 14: Dice are probe tested at 25°C to the limits shown in Table 1.
Except for high current tests, dice are tested under low current conditions
which assure full load current specifications when assembled.
Note 15: Dice that are not qualified by Linear Technology with a can
sample are guaranteed to meet specifications of Table 1 only. Dice
qualified by Linear Technology with a can sample meet specifications
in all tables.
Note 16: Please refer to the LT1965 standard product data sheet for
Typical Performance Characteristics, Pin Functions, Applications
Information, and Typical Applications.
IN
OUT(NOMINAL)
current source load. GND pin current increases slightly in dropout.
Note 9: ADJ pin bias current flows into the ADJ pin.
Note 10: SHDN pin current flows into the SHDN pin.
Note 11: Reverse-output current is tested with the IN pin grounded and
the OUT pin forced to 1.2V. This current flows into the OUT pin and out of
the GND pin.
Note 12: The minimum input voltage specification limits the dropout
voltage under some output voltage/load conditions
Note 13: This IC includes overtemperature protection that is intended
to protect the device during momentary overload conditions. Junction
temperature exceeds the maximum junction temperature when
table 4. post burn-in enDpoints anD Delta limit
requirements
TA = 25°C
ENDPOINT LIMITS
DELTA LIMITS
PARAMETER
CONDITIONS
= 2.1V, I
MIN
MAX
1.218
4.5
MIN
MAX
0.010
0.4
UNITS
V
ADJ Pin Voltage (Notes 4, 5)
ADJ Pin Bias Current (Notes 4, 9)
V
= 1mA
LOAD
1.182
–0.010
–0.4
IN
μA
table 5. electrical test requirements
PDA Test Notes
MIL-STD-883 TEST REQUIREMENTS
SUBGROUP
1*, 2, 3
1, 2, 3
The PDA is specified as 5% based on failures from group A, subgroup 1,
tests after cooldown as the final electrical test in accordance with method
5004 of MIL-STD-883. The verified failures of group A, subgroup 1, after
burn-in divided by the total number of devices submitted for burn-in in
that lot shall be used to determine the percent for the lot.
Final Electrical Test Requirements (Method 5004)
Group A Test Requirements (Method 5005)
Group B and D for Class S,
End Point Electrical Parameters (Method 5005)
1, 2, 3
Linear Technology Corporation reserves the right to test to tighter limits
than those given.
*PDA applies to subgroup 1. See PDA Test Notes.
rh1965mkf
5
For more information www.linear.com/RH1965MK
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