RABS22 THRU RABS210
2.0A Miniature Glass Passivated
Single-Phase Surface Mount
Bridge Rectifiers-200-1000V
Features
Package outline
• Glass passivated junction
LMDS(ABS)
• Ideal for printed circuit board
• Reliable low cost construction utilizing molded
plastic technique
• High temperature soldering guaranteed:
260°C / 10 seconds / 0.375” ( 9.5mm )
lead length at 5 lbs., ( 2.3 kg ) tension
• High surge current capability
Compliant to Halogen-free
•
Mechanical data
• Epoxy:UL94-V0 rated flame retardant
• Case : Molded plastic, LMDS(ABS)
• Terminals : Solder plated, solderable per
MIL-STD-202, Method 208
• Polarity : marked on body
• Mounting Position : Any
Maximum ratings and Electrical Characteristics (AT TA=25oC unless otherwise noted)
MIN.
MAX.
PARAMETER
Forward rectified current
Forward surge current
CONDITIONS
UNIT
Symbol
TYP.
IO
A
A
2.0
On aluminum substrate
8.3ms single half sine-wave superimposed on
rate load (JEDEC methode)
IFSM
50
VR = VRRM TJ = 25OC
VR = VRRM TJ = 125OC
5.0
Reverse current
IR
μA
200
(Note 2)
RθJA
Typical Thermal resistance
Typical Junction Capacitance
Storage temperature
Junction to ambient
62.5
OC/W
pF
C
j
(Note 3)
30
OC
TSTG
+150
-55
Operating
*1
*3
*2
VRMS
*4
*5
VR
SYMBOLS
VRRM
trr
VF
temperature
*1 Repetitive peak reverse voltage
*2 RMS voltage
TJ, (OC)
(V)
(V)
(V)
140
280
(ns)
(V)
200
400
RABS22
RABS24
RABS26
RABS28
200
150
250
500
*3 Continuous reverse voltage
*4 Maximum Reverse recovery time, note 1
*5 Maximum forward voltage@IF=2.0A
400
600
800
-55 to +150
1.30
420
560
600
800
RABS210
700
1000
1000
Note 1. Reverse recovery time test condition, IF=0.5A, IR=1.0A, IRR=0.25A
2.
3.
Mounted on glass epoxy PC board with 4*1.5"*1.5"(3.81*3.81cm)copper pad
Measured at 1 MHz and applied reverse voltage of 4 VD.C
http://www.anbonsemi.com
TEL:+86-755-23776891
Document ID
AS-3050106
Issued Date
2015/09/08
Revised Date
Revision
Page.
2022/05/16
D
3
Page 1
FAX:+86-755-81482812