FIG 1
REVISION U
QSE-XXX-01-X-D-DP-EMX-XX
QSE-042-01-X-D-DP-EMX SHOWN
OPTION
-GP: GUIDE POST
(SEE FIG 3, SHEET 2)
No OF PAIRS
ASO ONLY (APPLICATION SPECIFIC ORDER)
*
-014, -028, -042
** -056, **-070
(PER ROW)
EM3-GP=NOT TOOLED
*
((No OF POSITIONS / 14) x .7875[20.003]) + .440[11.18] REF
** SEE NOTE 11
EDGE MOUNT THICKNESS
C
LEAD STYLE
-EM2: .064[1.63] +/-.004 PCB
(USE QSE-20-01-D-EM2-XX & C-162-01-X)
-01: .1380[3.505]
((No OF POSITIONS / 14) x .7875[20.003]) + .0100[.254] REF
.793 20.130 REF
U
-EM3: (USE QSE-20-01-D-EM3-XX
& C-162-02-X)
PLATING SPECIFICATION
SEE NOTE 10
02
PLATING THICKNESSES ARE FOR
SIGNAL PINS ONLY. FOR GROUND
PLANE THICKNESSES, SEE PP-T-1G13-XX-X.
-F: 3µ" FLASH SELECTIVE GOLD IN CONTACT
AREA MATTE TIN ON TAIL (SEE NOTE 6)
(USE C-162-XX-F & T-1G13-01-F)
-L: 10µ" LIGHT SELECTIVE GOLD IN CONTACT
AREA WITH MATTE TIN ON TAIL
DIFFERENTIAL PAIR
.2850 7.239
REF
DO NOT
SCALE FROM
THIS PRINT
ROW SPECIFICATION
-D: DOUBLE (USE QSE-20-01-D-EMX-XX)
01
.6250 15.875
'D'
.0225 0.571
REF
(USE C-162-XX-L & T-1G13-01-L)
-H: 30µ" HEAVY GOLD IN CONTACT AREA,
3µ" FLASH GOLD ON TAIL
No OF BANKS
REF
6 EQ SPACES
@ .0945 [2.400]
(USE C-162-XX-H & T-1G13-01-G)
-TL: TIN/LEAD (90/10 5%) CONTACT AND TAIL
-S: 30µ" SELECTIVE GOLD IN CONTACT AREA,
(USE C-162-XX-S & T-1G13-01-L)
MATTE TIN ON TAIL
U
C
.1180 2.997
C-162-02-X
QSE-20-01-D-EMX-03
QSE-20-01-D-EM2-XX
C-162-01-X
.175 4.45
REF
QSE-20-01-D-EM3-XX
SEE NOTE 12
.120 3.05 REF
"A"
U
SEE NOTE 5
.2380 6.045
REF
SEE TABLE 1
C
"A"
.0920±.0030 2.338±0.076
.1370±.0030 3.480±0.08
C
.0890 2.261 REF
C
T-1G13-01-X
.7250 18.415
REF
.0660±.0030 1.676±0.076
.0580 1.473 REF
2
MAX SWAY
(TYP)
.1545 3.924
SECTION "A-A"
SECTION "A"-"A"
.1200 3.048
REF
.0060 0.152
REF
EDGE MOUNT THICKNESS
-EM3:
(DIFFERENT AS SHOWN, OTHERWISE
SAME AS -EM2 PCB THICKNESS)
(SEE NOTE 10)
EDGE MOUNT THICKNESS
-EM2: .064 [1.63] +/-.004 PCB
NOTES:
C
1.
REPRESENTS A CRITICAL DIMENSION.
2. CONTACT RETENTION: 6 OZ MIN.
3. GROUND PLANE RETENTION: 8 OZ MIN.
4. PARTS ARE MOLD TO POSITION.
5. MAX VARIANCE OF .002[.05].
.0400 1.016 REF
.0070 0.178 REF
6. -L PLATING CAN BE SUBSTITUTED FOR -F PLATING.
7. NOTE DELETED.
8. BOARD THICKNESS TO BE MEASURED FROM SOLDER PAD TO SOLDER PAD.
9. SEE http://www.samtec.com/processing/edgemt_tectalk/index.htm
FOR INFORMATION ON PROCESSING EDGE MOUNT PARTS.
10. -EM3 IS NOT A STANDARD OFFERING; AVAILABLE AS AN ASP ONLY.
PLEASE CONTACT SAMTEC INTERCONNECT PROCESSING GROUP WITH ORDER INQUIRIES
11. FOR NEW APPLICATIONS REQUIRING THESE POSITIONS, PLEASE CONTACT SAMTEC
INTERCONNECT PROCESSING GROUP.
.1000 2.540 REF
.1600 4.064 REF
U
12. SIDE WALLS ARE RIBBED AS NECESSARY TO CONTROL BOW.
PROPRIETARY NOTE
UNLESS OTHERWISE SPECIFIED,
DIMENSIONS ARE IN INCHES.
TOLERANCES ARE:
THIS DOCUMENT CONTAINS INFORMATION
CONFIDENTIAL AND PROPRIETARY TO
SAMTEC, INC. AND SHALL NOT BE REPRODUCED
OR TRANSFERRED TO OTHER DOCUMENTS OR
DISCLOSED TO OTHERS OR USED FOR ANY
PURPOSE OTHER THAN THAT WHICH IT WAS
OBTAINED WITHOUT THE EXPRESSED WRITTEN
CONSENT OF SAMTEC, INC.
DECIMALS
ANGLES
.XX: .01[.3]
2
520 PARK EASTBLVD, NEW ALBANY, IN 47150
.XXX: .005[.13]
PHONE: 812-944-6733
e-Mail: info@SAMTEC.com
FAX: 812-948-5047
code: 55322
.XXXX: .0020[.051]
TABLE 1
MATERIAL:
DO NOT SCALE DRAWING
SHEETSCALE: 1.25:1
DESCRIPTION:
C
INSULATOR: LCP, UL 94VO
COLOR: BLACK
.8mm EDGEMOUNT DIFF PAIR HS SOCKET ASSEMBLY
DWG. NO.
GND PLANE
COPLANARITY
ASSEMBLY
BOW
U
No OF PAIRS
QSE-XXX-01-X-D-DP-EMX-XX
CONTACT: PHOS BRONZE
GROUND PLANE: PHOS BRONZE
-014 THRU -042
-056 THRU -070
.004 [.10]
.005[1.27]
.004 [.10]
.005[1.27]
SHEET1 OF 2
BY:
DEAN P
4/10/2001
F:\DWG\MISC\MKTG\QSE-XXX-01-X-D-DP-EMX-XX-MKT.SLDDRW