F-213
QFS–026–04.25–L–D–A
TM
(0,635 mm) .025"
QFS SERIES
QFS–026–04.25–L–D–A–GP
QFS–032–04.25–L–D–DP–A
RUGGED GROUND PLANE SOCKET
Increased insertion
depth for rugged applications
Integral metal plane
for power or ground
Board Mates:
QMS
SPECIFICATIONS
®
For complete specifications and
recommended PCB layouts see
www.samtec.com?QFS
Insulator Material:
Liquid Crystal Polymer
Contact & Ground
Plane Material:
Phosphor Bronze
Plating:
APPLICATION
SPECIFIC
Au over 50µ" (1,27 µm) Ni
(Tin on Ground Plane Tail)
Current Rating:
•
•
Power & RF options
Edge Mount
Contact:
1.6A per contact @ 95°C
Ground Plane:
Rated @ 3dB Insertion Loss
QMS/QFS
• Without PCB
Alignment Pins
• Hot Pluggable
• 4 banks
(104 -SE, 64 -DP)
Type
9.2A per ground plane @ 95°C
Voltage Rating:
10 mm Stack Height
with PCB effects* w/o PCB effects**
(1,60 mm)
.063"
NOMINAL
WIPE
Single-Ended Signaling
–D 9 GHz / 18 Gbps 8 GHz / 16 Gbps
300 VAC mated with QMS
Operating Temp:
-55°C to +125°C
Differential Pair Signaling –D 8 GHz / 16 Gbps 8.5 GHz / 17 Gbps
Differential Pair Signaling –DP 7.5 GHz / 15 Gbps 9 GHz / 18 Gbps
*Performance data includes effects of a non-optimized PCB.
**Test board losses de-embedded from performance data.
RoHS Compliant:
Yes
Call Samtec.
Processing:
Performance data for other stack heights and complete test data
available at www.samtec.com?QFS or contact sig@samtec.com
Lead–Free Solderable:
Yes
SMT Lead Coplanarity:
(0,10 mm) .004" max (026-078)
Board Stacking:
For applications requiring more
than two connectors per board
contact ipg@samtec.com
LEAD
STYLE
PINS PER ROW
NO. OF PAIRS
PLATING
OPTION
OTHER
OPTION
TYPE
QFS
A
Specify
LEAD
STYLE
from
–GP
= Guide
Holes
( –04.25
lead style
only)
–L
–D
–026, –052, –078
(–04.25 lead style only)
= 10µ" (0,25 µm) Gold on Signal
Pins and Ground Plane
= Single-Ended
(52 total pins per bank = –D)
chart
–D–DP
= Differential Pair
(–04.25 lead style only)
–016, –032, –048
(Tin on Signal Pin tails, and
Ground Plane tails)
(16 pairs per bank = –D–DP)
MATED HEIGHT*
–SL
(–06.25 lead style only)
= 10µ" (0,25 µm) Gold on Signal
Pins and Ground Plane
(Tin on Signal Pin tails, and
Ground Plane tails)
QMS LEAD STYLE
APPLICATION
LEAD
STYLE
A
–05.75 –06.75 –09.75
(7,44) .293 10 mm
11 mm
14 mm
–04.25
–06.25
(9,42) .371 12 mm
13 mm
16 mm
STACK
HEIGHT
(0,10)
.004
*Processing conditions will affect mated height.
(0,44)
.017
GP = No. of Banks x (21,34) .840 + (12,45) .490
A
No. of Banks x (21,34) .840 + (1,02) .040
(0,635)
Requires Standoff
SO-1524-03-01-01-L for 15,24 mm
or SO-2215-02-01-01-L for 22 mm
board spacing. Connectors designed
to not fully seat when mated.
(8,13)
.320
(21,34) .840
.025
02
(8,13)
.320
INTERCONNECTS
STACK
INDUSTRY
STANDARD
01
TERMINAL SOCKET BANKS
HEIGHT
15,24 mm
15,24 mm
22 mm
SUMIT™
ASP-129637-01 ASP-129646-01
1
3
2
3
(0,89)
.035
PCI/104-Express™ ASP-129637-03 ASP-129646-03
PCI/104-Express™ ASP-142781-02 ASP-129646-02
PCI/104-Express™ ASP-142781-03 ASP-129646-03
Note: Some lengths,
(1,02) .040 DIA
22 mm
styles and options are
–D
–D–DP
non-standard, non-returnable.
WWW.SAMTEC.COM