F-218 (Rev 05OCT17)
QFS–026–04.25–L–D–A
QFS–032–04.25–L–D–DP–A
QFS–026–04.25–L–D–A–GP
(0.635 mm) .025"
QFS SERIES
RUGGED GROUND PLANE SOCKET
Increased insertion
depth for rugged applications
Integral metal plane
for power or ground
Board Mates:
QMS
SPECIFICATIONS
(1.60 mm)
.063"
NOMINAL
WIPE
For complete specifications and
recommended PCB layouts see
www.samtec.com?QFS
Cable Mates:
6QCD
Insulator Material:
Liquid Crystal Polymer
Contact & Ground
Plane Material:
Phosphor Bronze
Plating:
Au over 50 µ" (1.27 µm) Ni
(Tin on Ground Plane Tail)
Current Rating:
Contact:
Standoffs:
SO, JSOM
POWER/SIGNAL
APPLICATION
ALSO
AVAILABLE
(MOQ Required)
2.6 A per pin
(2 pins powered)
Ground Plane:
• Other platings
15.7 A per ground plane
(1 ground plane powered)
Voltage Rating:
300 VAC mated with QMS
Operating Temp:
-55 °C to +125 °C
RoHS Compliant:
Yes
•
Without PCB
Alignment Pins
HIGH-SPEED CHANNEL PERFORMANCE
• Hot Pluggable
QMS-DP/QFS-DP @ 10 mm Mated Stack Height
• 4 banks
(104 -SE, 64 -DP)
Rating based on Samtec reference channel.
For full SI performance data visit Samtec.com
or contact SIG@samtec.com
Compatible with
UMPT/UMPS for flexible
two-piece power/signal solutions
25
Contact Samtec.
G
b
p
s
PROCESSING
Lead–Free Solderable:
Yes
LEAD
PINS PER ROW
NO. OF PAIRS
PLATING
OPTION
OTHER
OPTION
TYPE
QFS
A
STYLE
SMT Lead Coplanarity:
(0.10 mm) .004" max (026-078)
Board Stacking:
For applications requiring more
than two connectors per board
contact ipg@samtec.com
Specify
LEAD
STYLE
from
–GP
= Guide
Holes
( –04.25
lead style
only)
–L
–D
–026, –052, –078
(–04.25 lead style only)
RECOGNITIONS
= Single-Ended
(52 total pins per bank = –D)
= 10 µ" (0.25 µm) Gold on Signal
Pins and Ground Plane
(Tin on Signal Pin tails, and
Ground Plane tails)
chart
For complete scope of
recognitions see
www.samtec.com/quality
–D–DP
= Differential Pair
–016, –032, –048
(16 pairs per bank = –D–DP)
(–04.25 lead style only)
–SL
GP = No. of Banks x (21.34) .840 + (12.45) .490
FILE NO. E111594
(–06.25 lead style only)
= 10 µ" (0.25 µm) Gold on Signal
Pins and Ground Plane
(Tin on Signal Pin tails, and
Ground Plane tails)
APPLICATION
No. of Banks x (21.34) .840 + (1.02) .040
(0.635)
STANDARDS
• SUMIT™
• PCI/104-Express™
(21.34) .840
.025
02
(8.13)
.320
STACK
HEIGHT
(0.44)
.017
(0.10)
.004
01
PROTOCOLS
(0.89)
.035
Requires Standoff
SO-1524-03-01-01-L or
A
• 100 GbE
• FIbre Channel
• XAUI
JSOM-1524-02 for 15.24 mm
or SO-2215-02-01-01-L for 22 mm
board spacing. Connectors designed
to not fully seat when mated.
(1.02) .040 DIA
–D
(8.13)
.320
• PCI Express®
–D–DP
• SATA
INTERCONNECTS
SOCKET BANKS
MATED HEIGHT*
INDUSTRY
STACK
HEIGHT
15.24 mm
15.24 mm
15.24 mm
22 mm
STANDARD
SUMIT™
TERMINAL
QMS LEAD STYLE
LEAD
A
STYLE
–05.75 –06.75 –09.75
ASP-129637-01 ASP-129646-01
1
3
1
1
2
3
PCI/104-Express™ ASP-129637-03 ASP-129646-03
PCI/104-Express™ ASP-129637-13 ASP-129646-22
PCI/104-Express™ ASP-142781-01 ASP-129646-01
PCI/104-Express™ ASP-142781-02 ASP-129646-02
PCI/104-Express™ ASP-142781-03 ASP-129646-03
(7.44) .293 10 mm
11 mm
14 mm
–04.25
–06.25
(9.42) .371 12 mm
13 mm
16 mm
Note:
22 mm
22 mm
*Processing conditions will affect mated height.
See SO Series for board space tolerances.
Some lengths, styles and
options are non-standard,
non-returnable.
Due to technical progress, all designs, specifications and components are subject to change without notice.
WWW.SAMTEC.COM
All parts within this catalog are built to Samtec’s specifications.
Customer specific requirements must be approved by Samtec and identified in a Samtec customer-specific drawing to apply.
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