PVHT
Vishay Sfernice
www.vishay.com
High Stability - Very High Temperature (270 °C)
Thin Film Wraparound Chip Resistors, Sulfur Resistant
FEATURES
• Operating temperature range: -55 °C; +250 °C
• Storage temperature: -55 °C; +270 °C
• Gold terminations (< 1 μm thick)
• 5 sizes available (0402, 0603, 0805, 1206,
2010); other sizes upon request
• Temperature coefficient down to 5 ppm/°C
typical, 10 ppm/°C maximum (-55 °C; +270 °C)
• Tolerance down to 0.05 %
INTRODUCTION
• Load life stability: 0.8 % typical (1 % max.) after 2000 h at
250 °C (ambient) at Pn
For applications such as down hole applications, the need
for parts able to withstand very severe conditions
(temperature as high as 250 °C powered or up to 270 °C
un-powered) has led Vishay Sfernice to push out the limit of
the thin film technology.
• Shelf life stability: 1.5 % typical after 8000 h
• SMD wraparound
• 0.02 % upon request
Designers might read the application note “Power
Dissipation Considerations in High Precision Vishay
Sfernice Thin Film Chip Resistors and Arrays
(P, PRA etc…) (High Temperature Application)”
www.vishay.com/doc?53047 in conjunction with this
datasheet to help them to properly design their board and
get the best performances of the PVHT.
• TCR remains constant after long term storage at 270 °C
• Sulfur resistant (per ASTM B809-95 humid vapor test)
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
Vishay Sfernice research and development engineers will be
willing to support any customer design considerations.
STANDARD ELECTRICAL SPECIFICATIONS
RESISTANCE
RANGE
Ω
RATED POWER (1)(2)
LIMITING ELEMENT
TEMPERATURE
COEFFICIENT (3)
ppmꢁ°C
TOLERANCE
ꢀ
MODEL
SIZE
P250 °C
VOLTAGE
V
W
PVHT0402 0402
PVHT0603 0603
PVHT0805 0805
PVHT1206 1206
PVHT2010 2010
39 to 45K
39 to 108K
39 to 240K
39 to 900K
39 to 2.5M
0.031
0.062
0.100
0.165
0.2
50
75
0.05, 0.1, 0.5, 1
0.05, 0.1, 0.5, 1
0.05, 0.1, 0.5, 1
0.05, 0.1, 0.5, 1
0.05, 0.1, 0.5, 1
5, 10, 15, 25, 30, 50, 55
5, 10, 15, 25, 30, 50, 55
5, 10, 15, 25, 30, 50, 55
5, 10, 15, 25, 30, 50, 55
5, 10, 15, 25, 30, 50, 55
150
200
300
Notes
(1)
For power handling improvement, please refer to application note 53047 “Power Dissipation Considerations in High Precision Vishay
Sfernice Thin Film Chip Resistors and Arrays (High Temperature Applications)” www.vishay.com/doc?/53047 and consult Vishay Sfernice
See derating curve on next page
See Table 1 on next page
(2)
(3)
CLIMATIC SPECIFICATIONS
MECHANICAL SPECIFICATIONS
Substrate
Alumina
Operating temperature range
-55 °C; +250 °C
Resistive Element
Passivation
Protection
Thin Film
Silicon nitride (Si3N4)
Epoxy + Silicone
Storage temperature range
-55 °C; +270 °C
Terminations
Gold (< 1 μm) over nickel barrier
PERFORMANCE VS. HUMID SULFUR VAPOR
Caution:
50 °C 2 °C, 85 % 4 % RH,
Test conditions
exposure time 500 h
Performances obtained with following mounting conditions:
• Test board material: alumina
Resistance drift < (0.05 % R + 0.05 Ω),
Test results
no corrosion products observed
• Solder paste: PbSnAg (93.5/5/1.5)
Revision: 13-Nov-15
Document Number: 53060
1
For technical questions, contact: sferthinfilm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000