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PTPS659107A1RSL

更新时间： 2024-01-18 06:20:30
品牌 Logo 应用领域
德州仪器 - TI /
页数 文件大小 规格书
89页 941K
描述
1-CHANNEL POWER SUPPLY SUPPORT CKT, PQCC48, 6 X 6 MM, 1 MM HEIGHT, 0.40 MM PITCH, GREEN, PLASTIC, VQFN-48

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PTPS659107A1RSL 技术参数

是否Rohs认证： 符合生命周期：Obsolete
零件包装代码：QFN包装说明：HVQCCN, LCC48,.24SQ,16
针数：48Reach Compliance Code：compliant
ECCN代码：EAR99HTS代码：8542.39.00.01
风险等级：5.84可调阈值：YES
模拟集成电路 - 其他类型：POWER SUPPLY SUPPORT CIRCUITJESD-30 代码：S-PQCC-N48
长度：6 mm信道数量：1
功能数量：1端子数量：48
最高工作温度：85 °C最低工作温度：-40 °C
封装主体材料：PLASTIC/EPOXY封装代码：HVQCCN
封装等效代码：LCC48,.24SQ,16封装形状：SQUARE
封装形式：CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE峰值回流温度（摄氏度）：NOT SPECIFIED
电源：3.6 V认证状态：Not Qualified
座面最大高度：1 mm子类别：Power Management Circuits
最大供电电压 (Vsup)：5.5 V最小供电电压 (Vsup)：2.7 V
标称供电电压 (Vsup)：3.6 V表面贴装：YES
温度等级：INDUSTRIAL端子形式：NO LEAD
端子节距：0.4 mm端子位置：QUAD
处于峰值回流温度下的最长时间：NOT SPECIFIED宽度：6 mm
Base Number Matches：1

PTPS659107A1RSL 数据手册

 浏览型号PTPS659107A1RSL的Datasheet PDF文件第2页浏览型号PTPS659107A1RSL的Datasheet PDF文件第3页浏览型号PTPS659107A1RSL的Datasheet PDF文件第4页浏览型号PTPS659107A1RSL的Datasheet PDF文件第5页浏览型号PTPS659107A1RSL的Datasheet PDF文件第6页浏览型号PTPS659107A1RSL的Datasheet PDF文件第7页 
TPS65910, TPS659101, TPS659102, TPS659103  
TPS659104, TPS659105, TPS659106, TPS659107, TPS659108, TPS659109  
www.ti.com  
SWCS046C –MARCH 2010–REVISED JUNE 2010  
Integrated Power Management Unit Top Specification  
Check for  
Samples: TPS65910, TPS659101, TPS659102, TPS659103, TPS659104, TPS659105, TPS659106, TPS659107, TPS659108, TPS659109  
1
FEATURES  
APPLICATIONS  
•
•
Portable and handheld systems  
OMAP3 power management  
The purpose of the TPS65910 device is to  
provide the following resources:  
•
•
Embedded power controller  
DESCRIPTION  
Two efficient step-down dc-dc converters for  
processor cores  
The TPS65910 is an integrated power-management  
IC available in 48-QFN package and dedicated to  
applications powered by one Li-Ion or Li-Ion polymer  
battery cell or 3-series Ni-MH cells, or by a 5-V input;  
it requires multiple power rails. The device provides  
three step-down converters, one step-up converter,  
and eight LDOs and is designed to support the  
specific power requirements of OMAP-based  
applications.  
•
One efficient step-down dc-dc converter for I/O  
power  
•
•
One efficient step-up 5-V dc-dc converter  
SmartReflex™ compliant dynamic voltage  
management for processor cores  
•
•
•
•
8 LDO voltage regulators and one RTC LDO  
(internal purpose)  
One high-speed I2C interface for  
Two of the step-down converters provide power for  
dual processor cores and are controllable by a  
dedicated class-3 SmartReflex interface for optimum  
power savings. The third converter provides power for  
the I/Os and memory in the system.  
general-purpose control commands (CTL-I2C)  
One high-speed I2C interface for SmartReflex  
Class 3 control and command (SR-I2C)  
Two enable signals multiplexed with SR-I2C,  
configurable to control any supply state and  
processor cores supply voltage  
The device includes eight general-purpose LDOs  
providing a wide range of voltage and current  
capabilities; they are fully controllable by the I2C  
interface. The use of the LDOs is flexible; they are  
intended to be used as follows: Two LDOs are  
designated to power the PLL and video DAC supply  
rails on the OMAP based processors, four  
general-purpose auxiliary LDOs are available to  
provide power to other devices in the system, and  
two LDOs are provided to power DDR memory  
supplies in applications requiring these memories.  
•
•
Thermal shutdown protection and hot-die  
detection  
A real-time clock (RTC) resource with:  
–
Oscillator for 32.768-kHz crystal or 32-kHz  
built-in RC oscillator  
–
–
Date, time and calendar  
Alarm capability  
In addition to the power resources, the device  
contains an embedded power controller (EPC) to  
manage the power sequencing requirements of the  
OMAP systems and an (RTC).  
•
•
One configurable GPIO  
DC-DC switching synchronization through  
internal or external 3-MHz clock  
Figure 1 shows the top-level diagram of the device.  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
PRODUCT PREVIEW information concerns products in the  
formative or design phase of development. Characteristic data and  
other specifications are design goals. Texas Instruments reserves  
the right to change or discontinue these products without notice.  
Copyright © 2010, Texas Instruments Incorporated  
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