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PS345

更新时间： 2024-11-19 01:24:55
品牌 Logo 应用领域
固锝 - GOOD-ARK /
页数 文件大小 规格书
4页 380K
描述
Surface Mount Schottky Rectifier

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中文翻译

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PS345 数据手册

 浏览型号PS345的Datasheet PDF文件第2页浏览型号PS345的Datasheet PDF文件第3页浏览型号PS345的Datasheet PDF文件第4页 
PS32 thru PS345  
Surface Mount Schottky Rectifier  
Reverse Voltage 20~45V Forward Current 3.0A  
Features  
• Heatsink structure  
• Low profile, typical thickness 0.8mm  
• Super Low VF Schottky barrier diodes  
• Moisture sensitivity: level 1, per J-STD-020  
• High temperature soldering guaranteed: 260℃/10 seconds  
iSGA  
(SOD-123HS)  
Typical Applications  
For use of fast swiching in RF module, lighting, cellular phone, portable device, power supplies  
and other consumer applications.  
Maximum Ratings (TA = 25 °C unless otherwise noted)  
PS32  
PS33  
PS34  
PS345  
Unit  
Parameter  
Symbol  
20  
14  
20  
30  
21  
30  
40  
28  
40  
45  
31.5  
45  
Maximum repetitive peak reverse voltage  
Maximum RMS voltage  
Maximum DC blocking voltage  
V
V
V
A
VRRM  
VRMS  
VDC  
3.0  
100  
42  
Maximum average forward rectified current  
IF(AV)  
Peak forward surge current 8.3 ms single half sine-  
wave superimposed on rated load  
A
IFSM  
A2sec  
°C  
I2t  
TJ  
Rating for fusing(t＜8.3ms)  
- 55 to + 150  
- 55 to + 150  
Operating junction temperature range  
Storage temperature range  
TSTG  
°C  
Electrical Characteristics (TA = 25 °C unless otherwise noted)  
PS32  
PS33  
PS34  
PS345  
Unit  
Parameter  
Test Conditions  
Symbol  
45  
VBR  
Ta=25℃,IR=1mA  
IF=3A,Ta=25℃  
Minimum Breakdown voltage  
0.51  
Volts  
Maximum instantaneous  
forward voltage  
VF  
0.45  
50  
IF=3A,Ta=125℃  
Ta=25℃  
Ta=125℃  
uA  
mA  
pF  
Maximum DC reverse current  
at rated DC blocking voltage  
IR  
10  
229  
60  
CJ  
Typical junction capacitance  
Typical thermal resistance  
4.0 V, 1 MHz  
1)  
juntion to ambient  
RθJA  
1)  
6
℃/W  
juntion to lead  
juntion to case  
RθJL  
2)  
28  
RθJC  
Note:1),The thermal resistance from junction to ambient or lead, mounted on P.C.B with 5×5mm copper pads,2 OZ,FR4 PCB  
2),The thermal resistance from junction to case, mounted on P.C.B with recommended copper pads,2 OZ,FR4 PCB  
www.goodark.com  
1/4  
2016.05-Rev.A  
1234

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