PS32 thru PS345
Surface Mount Schottky Rectifier
Reverse Voltage 20~45V Forward Current 3.0A
Features
• Heatsink structure
• Low profile, typical thickness 0.8mm
• Super Low VF Schottky barrier diodes
• Moisture sensitivity: level 1, per J-STD-020
• High temperature soldering guaranteed: 260℃/10 seconds
iSGA
(SOD-123HS)
Typical Applications
For use of fast swiching in RF module, lighting, cellular phone, portable device, power supplies
and other consumer applications.
Maximum Ratings (TA = 25 °C unless otherwise noted)
PS32
PS33
PS34
PS345
Unit
Parameter
Symbol
20
14
20
30
21
30
40
28
40
45
31.5
45
Maximum repetitive peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
V
V
V
A
VRRM
VRMS
VDC
3.0
100
42
Maximum average forward rectified current
IF(AV)
Peak forward surge current 8.3 ms single half sine-
wave superimposed on rated load
A
IFSM
A2sec
°C
I2t
TJ
Rating for fusing(t<8.3ms)
- 55 to + 150
- 55 to + 150
Operating junction temperature range
Storage temperature range
TSTG
°C
Electrical Characteristics (TA = 25 °C unless otherwise noted)
PS32
PS33
PS34
PS345
Unit
Parameter
Test Conditions
Symbol
45
VBR
Ta=25℃,IR=1mA
IF=3A,Ta=25℃
Minimum Breakdown voltage
0.51
Volts
Maximum instantaneous
forward voltage
VF
0.45
50
IF=3A,Ta=125℃
Ta=25℃
Ta=125℃
uA
mA
pF
Maximum DC reverse current
at rated DC blocking voltage
IR
10
229
60
CJ
Typical junction capacitance
Typical thermal resistance
4.0 V, 1 MHz
1)
juntion to ambient
RθJA
1)
6
℃/W
juntion to lead
juntion to case
RθJL
2)
28
RθJC
Note:1),The thermal resistance from junction to ambient or lead, mounted on P.C.B with 5×5mm copper pads,2 OZ,FR4 PCB
2),The thermal resistance from junction to case, mounted on P.C.B with recommended copper pads,2 OZ,FR4 PCB
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2016.05-Rev.A