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PS21342-N PDF预览

PS21342-N

更新时间: 2024-11-18 06:05:15
品牌 Logo 应用领域
三菱 - MITSUBISHI /
页数 文件大小 规格书
9页 176K
描述
Intelligent Power Module TRANSFER-MOLD TYPE INSULATED TYPE

PS21342-N 数据手册

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MITSUBISHISEMICONDUCTOR<IntelligentPowerModule>
PS21342-N
TRANSFER-MOLDTYPE
INSULATEDTYPE
PS21342-N  
INTEGRATED POWER FUNCTIONS  
600V/5A low-loss 4th generation (planar) IGBT inverter  
bridge for 3 phase DC-to-AC power conversion.  
INTEGRATED DRIVE, PROTECTION AND SYSTEM CONTROL FUNCTIONS  
• For upper-leg IGBTS :Drive circuit, High voltage isolated high-speed level shifting, Control circuit under-voltage (UV) protection.  
Note : Bootstrap supply scheme can be applied.  
• For lower-leg IGBTS : Drive circuit, Control circuit under-voltage protection (UV), Short-circuit protection (SC).  
• Fault signaling : Corresponding to a SC fault (Low-side IGBT) or a UV fault (Low-side IGBT).  
• Input interface : 5V line CMOS/TTL compatible, Schmitt Trigger receiver circuit.  
APPLICATION  
AC100V~200V inverter drive for motor control.  
Fig. 1 PACKAGE OUTLINES  
Dimensions in mm  
(3.556)  
(1.656)  
TERMINAL CODE  
(3.556)  
(1)  
HEAT SINK SIDE  
1
VUFS  
(UPG)  
VUFB  
VP1  
(0.5)  
TERMINAL  
(0.5)  
2
3
4
5
6
7
8
(COM)  
UP  
VVFS  
(VPG)  
VVFB  
VP1  
(COM)  
VP  
VWFS  
(WPG)  
VWFB  
VP1  
(COM)  
WP  
(UNG)  
VNO(NC)  
UN  
VN  
WN  
FO  
CFO  
CIN  
VNC  
VN1  
(WNG)  
(VNG)  
P
U
V
W
N
PCB  
PATTERN  
(1)  
(1.9)  
(1)  
(0.5)  
SLIT  
9
(1.8MIN)  
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
24  
25  
26  
27  
28  
29  
30  
31  
32  
33  
34  
35  
(PCB LAYOUT)  
DUMMY PIN  
Detail A  
(1.778 × 26)  
*Note2  
(1.778)  
(5)  
(6.25)(6.25) (6.25) (8)  
(8)  
A
28 27 26 25 24 23 22 21 20 19 18 16  
17  
15 13  
14  
12 10  
11  
9
8
7
6
5
4
3 2 1  
29  
Type name , Lot No.  
30  
HEAT SINK SIDE  
35  
34  
33  
32  
31  
(7.62)  
(4MIN)  
(7.62 × 4)  
(1.25)  
(2.5)  
(41)  
(42)  
(49)  
*Note1:(***) = Dummy Pin.  
*Note 2: In order to increase the surface distance between terminals, cut a slit, etc. on the PCB surface  
when mounting a module.  
Sep. 2001  

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