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PR02000201201JA100 PDF预览

PR02000201201JA100

更新时间: 2024-02-23 05:00:22
品牌 Logo 应用领域
威世 - VISHAY 电阻器
页数 文件大小 规格书
20页 214K
描述
RES 1.2K OHM 5% 2W AXIAL

PR02000201201JA100 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active包装说明:Axial,
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8533.21.00.90风险等级:1.29
Samacsys Description:PR02 Resistor,A/P,AXL,5%,2W,1K2 Vishay PR02 Series Axial Metal Film Resistor 1.2kΩ ±5% 2W ±250ppm/°C构造:Tubular
JESD-609代码:e3引线直径:0.78 mm
安装特点:THROUGH HOLE MOUNT端子数量:2
最高工作温度:155 °C最低工作温度:-55 °C
封装直径:3.9 mm封装长度:12 mm
封装形状:TUBULAR PACKAGE封装形式:Axial
包装方法:AMMO PACK额定功率耗散 (P):2 W
额定温度:70 °C参考标准:AEC-Q200
电阻:1200 Ω电阻器类型:FIXED RESISTOR
子类别:FIXED RESISTOR表面贴装:NO
技术:METAL FILM温度系数:250 ppm/ °C
端子面层:Tin (Sn)端子形状:WIRE
容差:5%工作电压:500 V

PR02000201201JA100 数据手册

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PR01, PR02, PR03  
Vishay BCcomponents  
www.vishay.com  
FUNCTIONAL PERFORMANCE  
The power that the resistor can dissipate depends on the operating temperature.  
100  
80  
60  
40  
20  
0
-55  
0
50  
100  
150  
200  
70  
Ambient Temperature in °C  
Derating  
Maximum dissipation (Pmax.) in percentage of rated power as a function of the ambient temperature (Tamb  
)
50  
50  
ΔT  
(K)  
ΔT  
(K)  
15 mm  
20 mm  
15 mm  
20 mm  
40  
30  
40  
30  
20  
10  
0
20  
10  
0
0
0.4  
0.8  
1.2  
0
0.4  
0.8  
1.2  
P (W)  
P (W)  
Ø 0.58 mm FeCu-leads  
Ø 0.58 mm Cu-leads  
Minimum distance from resistor body to PCB = 1 mm  
Minimum distance from resistor body to PCB = 1 mm  
PR01 Temperature rise (T) at the lead end (soldering point) as a  
function of dissipated power at various lead lengths after mounting.  
PR01 Temperature rise (T) at the lead end (soldering point) as a  
function of dissipated power at various lead lengths after mounting.  
70  
100  
ΔT  
Δ
T
(K)  
15 mm  
20 mm  
(K)  
80  
60  
15 mm  
20 mm  
50  
40  
30  
20  
10  
0
60  
40  
20  
0
0
1
2
0
1
2
P
(W)  
P (W)  
Ø 0.78 mm Cu-leads  
Minimum distance from resistor body to PCB = 1 mm  
Ø 0.58 mm FeCu-leads  
Minimum distance from resistor body to PCB = 1 mm  
PR02 Temperature rise (T) at the lead end (soldering point) as a  
function of dissipated power at various lead lengths after mounting.  
PR02 Temperature rise (T) at the lead end (soldering point) as a  
function of dissipated power at various lead lengths after mounting.  
Revision: 11-Jul-2018  
Document Number: 28729  
5
For technical questions, contact: filmresistorsleaded@vishay.com  
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT  
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000  

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