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PPC5534AVZ40

更新时间: 2024-11-29 06:04:47
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飞思卡尔 - FREESCALE 微控制器
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Microcontroller

PPC5534AVZ40 数据手册

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Document Number: MPC5534  
Rev. 0, 06/2006  
Freescale Semiconductor  
Data Sheet: Product Preview  
MPC5534 Microcontroller  
Data Sheet  
by: Microcontroller Division  
Contents  
This document provides electrical specifications, pin  
assignments, and package diagrams for the MPC5534  
microcontroller device. For functional characteristics,  
refer to the MPC5534 Microcontroller Reference  
Manual.  
1
2
3
Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1  
Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3  
Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 4  
3.1 Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . 4  
3.2 Thermal Characteristics. . . . . . . . . . . . . . . . . . . . . . 5  
3.3 Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8  
3.4 EMI (Electromagnetic Interference) Characteristics 8  
3.5 ESD Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 9  
3.6 VRC/POR Electrical Specifications . . . . . . . . . . . . . 9  
3.7 Power Up/Down Sequencing. . . . . . . . . . . . . . . . . 10  
3.8 DC Electrical Specifications. . . . . . . . . . . . . . . . . . 12  
3.9 Oscillator & FMPLL Electrical Characteristics . . . . 19  
3.10 eQADC Electrical Characteristics . . . . . . . . . . . . . 20  
3.11 H7Fb Flash Memory Electrical Characteristics . . . 22  
3.12 AC Specifications . . . . . . . . . . . . . . . . . . . . . . . . . 23  
3.13 AC Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25  
1
Overview  
The MPC5534 microcontroller (MCU) is a member of  
the MPC5500 family of microcontrollers based on the  
PowerPC™ Book E architecture. This family of parts  
contains many new features coupled with high  
performance CMOS technology to provide substantial  
reduction of cost per feature and significant performance  
improvement over the MPC500 family.  
4
5
Mechanicals. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45  
4.1 Pinouts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45  
4.2 Package Dimensions. . . . . . . . . . . . . . . . . . . . . . . 46  
Revision History. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49  
The host processor core of this device is compatible with  
the PowerPC Book E architecture. It is 100% user mode  
compatible (with floating point library) with the classic  
PowerPC instruction set. The Book E architecture has  
enhancements that improve the PowerPC architecture’s  
fit in embedded applications. This core also has  
additional instructions, including digital signal  
processing (DSP) instructions, beyond the classic  
This document contains information on a new product. Specifications and information herein  
are subject to change without notice.  
© Freescale Semiconductor, Inc., 2006. All rights reserved.  
Preliminary—Subject to Change Without Notice  

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