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PM5420C-FEI PDF预览

PM5420C-FEI

更新时间: 2024-11-16 20:04:47
品牌 Logo 应用领域
美国微芯 - MICROCHIP 电信电信集成电路
页数 文件大小 规格书
4页 851K
描述
Telecom Circuit, 1-Func, PBGA1517

PM5420C-FEI 技术参数

生命周期:Active包装说明:BGA,
Reach Compliance Code:compliant风险等级:5.65
JESD-30 代码:S-PBGA-B1517功能数量:1
端子数量:1517封装主体材料:PLASTIC/EPOXY
封装代码:BGA封装形状:SQUARE
封装形式:GRID ARRAY表面贴装:YES
电信集成电路类型:TELECOM CIRCUIT端子形式:BALL
端子位置:BOTTOMBase Number Matches:1

PM5420C-FEI 数据手册

 浏览型号PM5420C-FEI的Datasheet PDF文件第2页浏览型号PM5420C-FEI的Datasheet PDF文件第3页浏览型号PM5420C-FEI的Datasheet PDF文件第4页 
Communication Products  
PM5420 HyPHY-20G  
High-Capacity Single-Chip Multi-Rate/Multi-Protocol OTN Processor  
Summary  
The PM5420 HyPHY-20G device is a feature-rich, high-capacity system-on-a-chip solution that enables universal multi-rate, multi-  
service line cards, transponder cards and muxponder cards for Multi-Service Provisioning Platforms (MSPPs), Wavelength Division  
Multiplexing (WDM) Platforms, Reconfigurable Optical Add-Drop Multiplexers (ROADMs), Optical Transport Platforms (OTPs),  
Packet-OTPs and Optical Access Platforms.  
The HyPHY-20G delivers unprecedented single-chip scalability and feature integration to enable optimal footprint, power and cost  
efficiency. The HyPHY-20G provides a rich set of framing, mapping and multiplexing resources for a variety of protocols, including  
OTN, SONET/SDH, Ethernet, Fibre Channel, ESCON, FICON and multi-rate bit transparent services such as video.  
The HyPHY-20G Introduces an Array of  
Innovative Technologies  
Rate-Agile Programmable Transceiver IO (RAPTR IO): gap-  
less rate-agile SERDES from 16 Mbits to 5 Gbit/s for direct  
connect to SFPs and from 8.5 Gbit/s to 11.32 Gbit/s for  
direct connect to SFP+ (limiting) and XFP modules  
Tri-FEC: Interoperable ITU-T G.709 and G.975.1 (I.4 and I.7)  
FEC  
OTN Phase Signaling Algorithm (OPSA): improve jitter  
performance when transporting clients over OTN  
OTN Payload Tributary Mapping (OPTM): low-order map-  
ping into OPU1  
Constant Bit Rate Interface (CBRI): carry ODUks across  
system fabrics  
Benefits  
Carrier OPEX and CAPEX savings  
•ꢀ Simplifies equipment deployment and network manage-  
ment by enabling hybrid TDM/packet platforms  
•ꢀ Dramatically reduces cost of ownership by simplifying  
line card inventory management  
Unprecedented service delivery flexibility  
•ꢀ Supports per-port configurable OTN, SONET/SDH, Eth-  
ernet, SAN and bit transparent client services  
•ꢀ Rich suite of client service mappings into OTN and  
SONET/SDH  
•ꢀ OTN Tri-FEC for maximum network interoperability  
•ꢀ Enables full SNCP-base protection switching for  
meshed network topologies  
Processor-based carrier Ethernet  
•ꢀ Flexible implementations of Synchronous Ethernet, IEEE  
1588 Precision Timing Protocol (PTP) and Ethernet Link  
OAM (IEEE 802.3ah)  
•ꢀ Optimized power and footprint for OEMs  
Direct connect to SFP, SFP+ (limiting) and XFP modules  
for all rates with no external SERDES or PLL components  
required  
•ꢀ All frequencies derived from a single 155.52 MHz refer-  
ence clock  
•ꢀ Single-chip solution for muxponders, transponders and  
optical access platforms  
•ꢀ Glueless interconnect to many off-the-shelf NPs and  
fabrics  
www.microchip.com  

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