是否Rohs认证: | 符合 | 生命周期: | Active |
零件包装代码: | QFP | 包装说明: | TFQFP, TQFP64,.47SQ |
针数: | 64 | Reach Compliance Code: | compliant |
ECCN代码: | 3A991.A.2 | HTS代码: | 8542.31.00.01 |
Factory Lead Time: | 14 weeks | 风险等级: | 0.74 |
Samacsys Confidence: | 4 | Samacsys Status: | Released |
Samacsys PartID: | 459917 | Samacsys Pin Count: | 64 |
Samacsys Part Category: | Integrated Circuit | Samacsys Package Category: | Quad Flat Packages |
Samacsys Footprint Name: | (PT)64-Lead(TQFP) | Samacsys Released Date: | 2018-04-17 19:53:06 |
Is Samacsys: | N | 具有ADC: | YES |
其他特性: | ALSO OPERATES WITH 1.8 V MINIMUM SUPPLY AT 4 MHZ | 地址总线宽度: | |
位大小: | 32 | CPU系列: | PIC |
最大时钟频率: | 64 MHz | DAC 通道: | NO |
DMA 通道: | NO | 外部数据总线宽度: | |
JESD-30 代码: | S-PQFP-G64 | JESD-609代码: | e3 |
长度: | 10 mm | 湿度敏感等级: | 3 |
I/O 线路数量: | 53 | 端子数量: | 64 |
片上程序ROM宽度: | 16 | 最高工作温度: | 85 °C |
最低工作温度: | -40 °C | PWM 通道: | YES |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | TFQFP |
封装等效代码: | TQFP64,.47SQ | 封装形状: | SQUARE |
封装形式: | FLATPACK, THIN PROFILE, FINE PITCH | 峰值回流温度(摄氏度): | 260 |
电源: | 2/5 V | 认证状态: | Not Qualified |
RAM(字节): | 4096 | ROM(单词): | 65536 |
ROM可编程性: | FLASH | 座面最大高度: | 1.2 mm |
速度: | 64 MHz | 子类别: | Microcontrollers |
最大供电电压: | 5.5 V | 最小供电电压: | 3 V |
标称供电电压: | 3.3 V | 表面贴装: | YES |
技术: | CMOS | 温度等级: | INDUSTRIAL |
端子面层: | Matte Tin (Sn) - annealed | 端子形式: | GULL WING |
端子节距: | 0.5 mm | 端子位置: | QUAD |
处于峰值回流温度下的最长时间: | 40 | 宽度: | 10 mm |
uPs/uCs/外围集成电路类型: | MICROCONTROLLER | Base Number Matches: | 1 |
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