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PIC18F24K22-I/SP PDF预览

PIC18F24K22-I/SP

更新时间: 2024-11-25 06:03:31
品牌 Logo 应用领域
美国微芯 - MICROCHIP 微控制器
页数 文件大小 规格书
494页 5012K
描述
28/40/44-Pin, Low-Power, High-Performance Microcontrollers with nanoWatt XLP Technology

PIC18F24K22-I/SP 技术参数

是否Rohs认证: 符合生命周期:Active
零件包装代码:DIP包装说明:0.300 INCH, LEAD FREE, PLASTIC, SDIP-28
针数:28Reach Compliance Code:compliant
ECCN代码:3A001.A.3HTS代码:8542.31.00.01
Factory Lead Time:4 weeks风险等级:1.32
Samacsys Description:8-bit Microcontrollers - MCU 16KB Flash 768b RAM SERIAL EE IND具有ADC:YES
其他特性:ALSO OPERATES 2.3 V MINIMUM SUPPLY AT 20 MHZ地址总线宽度:
位大小:8CPU系列:PIC
最大时钟频率:64 MHzDAC 通道:YES
DMA 通道:NO外部数据总线宽度:
JESD-30 代码:R-PDIP-T28JESD-609代码:e3
长度:34.671 mmI/O 线路数量:25
端子数量:28片上程序ROM宽度:16
最高工作温度:85 °C最低工作温度:-40 °C
PWM 通道:YES封装主体材料:PLASTIC/EPOXY
封装代码:DIP封装等效代码:DIP28,.3
封装形状:RECTANGULAR封装形式:IN-LINE
峰值回流温度(摄氏度):NOT APPLICABLE电源:2/5 V
认证状态:Not QualifiedRAM(字节):768
ROM(单词):8192ROM可编程性:FLASH
座面最大高度:5.08 mm速度:64 MHz
子类别:Microcontrollers最大压摆率:12 mA
最大供电电压:5.5 V最小供电电压:2.7 V
标称供电电压:5 V表面贴装:NO
技术:CMOS温度等级:INDUSTRIAL
端子面层:Matte Tin (Sn) - annealed端子形式:THROUGH-HOLE
端子节距:2.54 mm端子位置:DUAL
处于峰值回流温度下的最长时间:NOT APPLICABLE宽度:7.62 mm
uPs/uCs/外围集成电路类型:MICROCONTROLLER, RISC

PIC18F24K22-I/SP 数据手册

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PIC18(L)F2X/4XK22  
Data Sheet  
28/40/44-Pin, Low-Power,  
High-Performance Microcontrollers  
with nanoWatt XLP Technology  
2010 Microchip Technology Inc.  
Preliminary  
DS41412A  

PIC18F24K22-I/SP 替代型号

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PIC18F26K22-I/SP MICROCHIP

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