是否无铅: | 不含铅 | 是否Rohs认证: | 符合 |
生命周期: | Not Recommended | 零件包装代码: | DIP |
包装说明: | DIP, DIP18,.3 | 针数: | 18 |
Reach Compliance Code: | compliant | ECCN代码: | EAR99 |
HTS代码: | 8542.31.00.01 | Factory Lead Time: | 17 weeks |
风险等级: | 7.24 | Samacsys Confidence: | |
Samacsys Status: | Released | Samacsys PartID: | 587107 |
Samacsys Pin Count: | 18 | Samacsys Part Category: | Integrated Circuit |
Samacsys Package Category: | Other | Samacsys Footprint Name: | DIP254P762X394-18 |
Samacsys Released Date: | 2017-01-11 17:13:05 | Is Samacsys: | N |
具有ADC: | NO | 地址总线宽度: | |
位大小: | 8 | CPU系列: | PIC |
最大时钟频率: | 4 MHz | DAC 通道: | NO |
DMA 通道: | NO | 外部数据总线宽度: | |
JESD-30 代码: | R-PDIP-T18 | JESD-609代码: | e3 |
长度: | 22.73 mm | I/O 线路数量: | 13 |
端子数量: | 18 | 片上程序ROM宽度: | 14 |
最高工作温度: | 70 °C | 最低工作温度: | |
PWM 通道: | NO | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | DIP | 封装等效代码: | DIP18,.3 |
封装形状: | RECTANGULAR | 封装形式: | IN-LINE |
峰值回流温度(摄氏度): | NOT SPECIFIED | 电源: | 2/6 V |
认证状态: | Not Qualified | RAM(字节): | 68 |
ROM(单词): | 1024 | ROM可编程性: | FLASH |
座面最大高度: | 3.94 mm | 速度: | 4 MHz |
子类别: | Microcontrollers | 最大压摆率: | 10 mA |
最大供电电压: | 6 V | 最小供电电压: | 2 V |
标称供电电压: | 5 V | 表面贴装: | NO |
技术: | CMOS | 温度等级: | COMMERCIAL |
端子面层: | Matte Tin (Sn) | 端子形式: | THROUGH-HOLE |
端子节距: | 2.54 mm | 端子位置: | DUAL |
处于峰值回流温度下的最长时间: | NOT SPECIFIED | 宽度: | 7.62 mm |
uPs/uCs/外围集成电路类型: | MICROCONTROLLER, RISC | Base Number Matches: | 1 |
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