是否无铅: | 不含铅 | 是否Rohs认证: | 符合 |
生命周期: | Active | 零件包装代码: | LCC |
包装说明: | PLASTIC, LCC-44 | 针数: | 44 |
Reach Compliance Code: | compliant | HTS代码: | 8542.31.00.01 |
风险等级: | 5.08 | 具有ADC: | YES |
地址总线宽度: | 位大小: | 8 | |
最大时钟频率: | 20 MHz | DAC 通道: | NO |
DMA 通道: | NO | 外部数据总线宽度: | |
JESD-30 代码: | S-PQCC-J44 | JESD-609代码: | e3 |
长度: | 16.5862 mm | 湿度敏感等级: | 1 |
I/O 线路数量: | 33 | 端子数量: | 44 |
片上程序ROM宽度: | 14 | 最高工作温度: | 70 °C |
最低工作温度: | PWM 通道: | YES | |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | QCCJ |
封装形状: | SQUARE | 封装形式: | CHIP CARRIER |
峰值回流温度(摄氏度): | 245 | 认证状态: | Not Qualified |
RAM(字节): | 368 | ROM(单词): | 8192 |
ROM可编程性: | OTPROM | 座面最大高度: | 4.572 mm |
速度: | 20 MHz | 最大供电电压: | 5.5 V |
最小供电电压: | 4.5 V | 标称供电电压: | 5 V |
表面贴装: | YES | 技术: | CMOS |
温度等级: | COMMERCIAL | 端子面层: | Matte Tin (Sn) |
端子形式: | J BEND | 端子节距: | 1.27 mm |
端子位置: | QUAD | 处于峰值回流温度下的最长时间: | 40 |
宽度: | 16.5862 mm | uPs/uCs/外围集成电路类型: | MICROCONTROLLER, RISC |
Base Number Matches: | 1 |
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