是否无铅: | 不含铅 | 是否Rohs认证: | 符合 |
生命周期: | Active | 零件包装代码: | SSOP |
包装说明: | SSOP, | 针数: | 28 |
Reach Compliance Code: | compliant | HTS代码: | 8542.31.00.01 |
风险等级: | 5.65 | 具有ADC: | YES |
地址总线宽度: | 位大小: | 8 | |
最大时钟频率: | 4 MHz | DAC 通道: | NO |
DMA 通道: | NO | 外部数据总线宽度: | |
JESD-30 代码: | R-PDSO-G28 | JESD-609代码: | e3 |
长度: | 10.2 mm | 湿度敏感等级: | 1 |
I/O 线路数量: | 22 | 端子数量: | 28 |
片上程序ROM宽度: | 14 | 最高工作温度: | 70 °C |
最低工作温度: | PWM 通道: | YES | |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | SSOP |
封装形状: | RECTANGULAR | 封装形式: | SMALL OUTLINE, SHRINK PITCH |
峰值回流温度(摄氏度): | 260 | 认证状态: | Not Qualified |
RAM(字节): | 368 | ROM(单词): | 8192 |
ROM可编程性: | OTPROM | 座面最大高度: | 2 mm |
速度: | 4 MHz | 最大供电电压: | 6 V |
最小供电电压: | 4 V | 标称供电电压: | 5 V |
表面贴装: | YES | 技术: | CMOS |
温度等级: | COMMERCIAL | 端子面层: | Matte Tin (Sn) |
端子形式: | GULL WING | 端子节距: | 0.65 mm |
端子位置: | DUAL | 处于峰值回流温度下的最长时间: | 40 |
宽度: | 5.3 mm | uPs/uCs/外围集成电路类型: | MICROCONTROLLER, RISC |
Base Number Matches: | 1 |
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