是否Rohs认证: | 符合 | 生命周期: | Active |
零件包装代码: | DIP | 包装说明: | DIP, DIP8,.3 |
针数: | 8 | Reach Compliance Code: | compliant |
ECCN代码: | EAR99 | HTS代码: | 8542.31.00.01 |
Factory Lead Time: | 6 weeks | 风险等级: | 1.41 |
Samacsys Confidence: | 3 | Samacsys Status: | Released |
Samacsys PartID: | 459317 | Samacsys Pin Count: | 8 |
Samacsys Part Category: | Integrated Circuit | Samacsys Package Category: | Dual-In-Line Packages |
Samacsys Footprint Name: | PDIP | Samacsys Released Date: | 2020-04-07 14:11:17 |
Is Samacsys: | N | 具有ADC: | YES |
地址总线宽度: | 位大小: | 8 | |
CPU系列: | PIC12 | 最大时钟频率: | 20 MHz |
DAC 通道: | YES | DMA 通道: | NO |
外部数据总线宽度: | JESD-30 代码: | R-PDIP-T8 | |
JESD-609代码: | e3 | 长度: | 9.271 mm |
低功率模式: | YES | I/O 线路数量: | 6 |
端子数量: | 8 | 计时器数量: | 4 |
片上数据RAM宽度: | 8 | 片上程序ROM宽度: | 14 |
最高工作温度: | 85 °C | 最低工作温度: | -40 °C |
PWM 通道: | YES | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | DIP | 封装等效代码: | DIP8,.3 |
封装形状: | RECTANGULAR | 封装形式: | IN-LINE |
峰值回流温度(摄氏度): | NOT SPECIFIED | 电源: | 2/5 V |
认证状态: | Not Qualified | RAM(字节): | 64 |
RAM(字数): | 64 | ROM(单词): | 1024 |
ROM可编程性: | FLASH | 座面最大高度: | 5.33 mm |
速度: | 20 MHz | 子类别: | Microcontrollers |
最大压摆率: | 3 mA | 最大供电电压: | 5.5 V |
最小供电电压: | 4.5 V | 标称供电电压: | 5 V |
表面贴装: | NO | 技术: | CMOS |
温度等级: | INDUSTRIAL | 端子面层: | Matte Tin (Sn) |
端子形式: | THROUGH-HOLE | 端子节距: | 2.54 mm |
端子位置: | DUAL | 处于峰值回流温度下的最长时间: | NOT SPECIFIED |
宽度: | 7.62 mm | uPs/uCs/外围集成电路类型: | MICROCONTROLLER, RISC |
Base Number Matches: | 1 |
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