是否无铅: | 不含铅 | 是否Rohs认证: | 符合 |
生命周期: | Obsolete | 零件包装代码: | SOIC |
包装说明: | LSSOP, TSOP5/6,.11,37 | 针数: | 5 |
Reach Compliance Code: | compliant | ECCN代码: | EAR99 |
HTS代码: | 8542.39.00.01 | 风险等级: | 5.59 |
Is Samacsys: | N | 其他特性: | CAN ALSO OPERATE WITH 5V NOMINAL SUPPLY |
模拟集成电路 - 其他类型: | SPST | JESD-30 代码: | R-PDSO-G5 |
JESD-609代码: | e3 | 长度: | 2.9 mm |
湿度敏感等级: | 1 | 正常位置: | NO |
信道数量: | 1 | 功能数量: | 1 |
端子数量: | 5 | 通态电阻匹配规范: | 1 Ω |
最大通态电阻 (Ron): | 18 Ω | 最高工作温度: | 85 °C |
最低工作温度: | -40 °C | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | LSSOP | 封装等效代码: | TSOP5/6,.11,37 |
封装形状: | RECTANGULAR | 封装形式: | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
峰值回流温度(摄氏度): | 260 | 电源: | 3.3/5 V |
认证状态: | Not Qualified | 座面最大高度: | 1.45 mm |
子类别: | Multiplexer or Switches | 最大供电电压 (Vsup): | 6 V |
最小供电电压 (Vsup): | 2 V | 标称供电电压 (Vsup): | 3.3 V |
表面贴装: | YES | 最长断开时间: | 20 ns |
最长接通时间: | 40 ns | 切换: | BREAK-BEFORE-MAKE |
技术: | CMOS | 温度等级: | INDUSTRIAL |
端子面层: | MATTE TIN (787) | 端子形式: | GULL WING |
端子节距: | 0.95 mm | 端子位置: | DUAL |
处于峰值回流温度下的最长时间: | 40 | 宽度: | 1.6 mm |
Base Number Matches: | 1 |
型号 | 品牌 | 替代类型 | 描述 | 数据表 |
ADG701BRTZ-REEL7 | ADI |
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