SPICE MODEL: PDS1040
PDS1040
10A SCHOTTKY BARRIER RECTIFIER
PowerDI ä5
Features
·
Guard Ring Die Construction for
Transient Protection
·
·
·
·
·
Low Power Loss, High Efficiency
Low Forward Voltage Drop
Very Low Leakage Current
High Forward Surge Current Capability
ä
PowerDI 5
A
D
b2
Min
1.05
0.33
0.80
1.70
3.90
Max
1.15
0.43
0.99
1.88
4.05
Dim
A
A2
L1
L1
For Use in Low Voltage, High Frequency Inverters,
Free Wheeling, and Polarity Protection Applications
A2
b1
b2
D
E
E1
·
·
Lead Free Finish, RoHS Compliant (Note 1)
"Green" Molding Compound (No Br, Sb)
e
Mechanical Data
LEFT PIN
BOTTOMSIDE
HEAT SINK
A2
b1
b1
3.05 NOM
D2
E
RIGHT PIN
Case: PowerDIä5
6.40
6.60
·
·
Note: Pins Left & Right must
be electrically connected
at the printed circuit board.
D
D2
b2
Case Material: Molded Plastic, “Green” Molding
Compound. UL Flammability Classification Rating
94V-0
e
1.84 NOM
L
E1
E2
L
5.30
5.45
3.55 NOM
E2
·
·
Moisture sensitivity: Level 1 per J-STD-020C
E
0.75
0.50
1.20
0.95
0.65
1.50
Terminals: Finish – Matte Tin annealed over
Copper leadframe. Solderable per MIL-STD-202,
W
L1
L1
W
e
3
Method 208
e
·
·
·
Polarity: See Diagram
b1
b1
All Dimensions in mm
Marking: See Page 3
Weight: 0.096 grams (approx.)
@ TA = 25°C unless otherwise specified
Maximum Ratings
Single phase, half wave, 60Hz, resistive or inductive load.
For capacitive load, derate current by 20%.
Value
Characteristic
Symbol
Unit
VRRM
VRWM
VR
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
40
V
VR(RMS)
IO
RMS Reverse Voltage
28
10
V
A
Average Rectified Output Current (see also Figure 5)
Non-Repetitive Peak Forward Surge Current
8.3ms Single half sine-wave Superimposed on Rated Load
IFSM
275
A
Tj
Operating Temperature Range
-65 to +150
-65 to +150
°C
°C
TSTG
Storage Temperature Range
@ TA = 25°C unless otherwise specified
Thermal Characteristics
Characteristic
Symbol
Typ
¾
Max
2.0
¾
Unit
°C/W
°C/W
RqJS
RqJA
RqJA
RqJA
Thermal Resistance Junction to Soldering Point
Thermal Resistance Junction to Ambient Air (Note 2)
Thermal Resistance Junction to Ambient Air (Note 3)
Thermal Resistance Junction to Ambient Air (Note 4)
95
75
50
¾
¾
Notes:
1. RoHS revision 13.2.2003. Glass and High Temperature Solder Exemptions Applied, see EU Directive Annex Notes 5 and 7.
2. FR-4 PCB, 2 oz. Copper, minimum recommended pad layout per http://www.diodes.com/datasheets/ap02001.pdf.
3. Polyimide PCB, 2 oz. Copper, minimum recommended pad layout per http://www.diodes.com/datasheets/ap02001.pdf.
4. Polyimide PCB, 2 oz. Copper. Cathode pad dimensions 9.4mm x 7.2mm. Anode pad dimensions 2.7mm x 1.6mm.
DS30538 Rev. 4 - 2
1 of 3
PDS1040
PowerDI is a trademark of Diodes Incorporated.
www.diodes.com
ã Diodes Incorporated