SPICE MODEL: PDS1045
PDS1045
10A SCHOTTKY BARRIER RECTIFIER
PowerDI ä5
Features
·
Guard Ring Die Construction for
Transient Protection
A
D
·
·
·
Very Low Forward Voltage Drop
High Forward Surge Current Capability
A2
b2
ä
PowerDI 5
L1
L1
Min
1.05
0.33
0.80
1.70
3.90
Max
1.15
0.43
0.99
1.88
4.05
Dim
A
For Use in Low Voltage, High Frequency Inverters,
Free Wheeling, and Polarity Protection Applications
E
E1
·
·
·
Lead Free Finish, RoHS Compliant (Note 1)
"Green" Molding Compound (No Br, Sb)
A2
b1
b2
D
Qualified to AEC-Q101 Standards for High Reliability
e
A2
b1
b1
D
Mechanical Data
D2
E
3.05 NOM
D2
b2
·
Case: PowerDIä5
6.40
6.60
L
·
Case Material: Molded Plastic, “Green” Molding Compound.
UL Flammability Classification Rating 94V-0
e
1.84 NOM
E2
E
E1
E2
L
5.30
5.45
·
·
Moisture Sensitivity: Level 1 per J-STD-020C
W
3.55 NOM
L1
Terminals: Finish – Matte Tin annealed over Copper
leadframe. Solderable per MIL-STD-202,
0.75
0.50
1.20
0.95
0.65
1.50
e
e
3
Method 208
L1
W
b1
b1
·
·
·
Polarity: See Diagram
LEFT PIN
BOTTOMSIDE
HEAT SINK
Marking: See Page 3
RIGHT PIN
All Dimensions in mm
Weight: 0.096 grams (approximate)
Note: Pins Left & Right must
be electrically connected
at the printed circuit board.
@ TA = 25°C unless otherwise specified
Maximum Ratings
Single phase, half wave, 60Hz, resistive or inductive load.
For capacitive load, derate current by 20%.
Value
Characteristic
Symbol
Unit
VRRM
VRWM
VR
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
45
V
VR(RMS)
IO
RMS Reverse Voltage
32
10
V
A
Average Rectified Output Current (see also Figure 4)
Non-Repetitive Peak Forward Surge Current
8.3ms Single half sine-wave Superimposed on Rated Load
IFSM
275
A
Operating Junction TemperatureRange
Storage Temperature Range
VR £ 80% VRRM
VR £ 50% VRRM
-65 to +125
-65 to +150
Tj
°C
°C
TSTG
-65 to +150
@ TA = 25°C unless otherwise specified
Thermal Characteristics
Characteristic
Symbol
Typ
¾
Max
0.8
¾
Unit
°C/W
°C/W
°C/W
°C/W
RqJS
RqJA
RqJA
RqJA
Thermal Resistance Junction to Soldering Point
Thermal Resistance Junction to Ambient Air (Note 2)
Thermal Resistance Junction to Ambient Air (Note 3)
Thermal Resistance Junction to Ambient Air (Note 4)
85
65
50
¾
¾
Notes:
1. RoHS revision 13.2.2003. Glass and High Temperature Solder Exemptions Applied, see EU Directive Annex Notes 5 and 7.
2. FR-4 PCB, 2 oz. Copper, minimum recommended pad layout per http://www.diodes.com/datasheets/ap02001.pdf.
3. Polymide PCB, 2 oz. Copper, minimum recommended pad layout per http://www.diodes.com/datasheets/ap02001.pdf.
4. Polymide PCB, 2 oz. Copper. Cathode pad dimensions 9.4mm x 7.2mm. Anode pad dimensions 2.7mm x 1.6mm.
DS30539 Rev. 10 - 2
1 of 3
PDS1045
PowerDI is a trademark of Diodes Incorporated.
www.diodes.com
ã Diodes Incorporated