SPICE MODEL: PDS1040CTL
PDS1040CTL
10A DUAL LOW VF SCHOTTKY BARRIER RECTIFIER
ä
PowerDI 5
Features
·
Guard Ring Die Construction for
Transient Protection
A
D
b2
·
·
·
·
Low Power Loss, High Efficiency
Low Forward Voltage Drop
Very Low Reverse Leakage Current
A2
ä
PowerDI 5
L1
Min
1.05
0.33
0.80
1.70
3.90
Max
1.15
0.43
0.99
1.88
4.05
Dim
A
E
E1
For Use in Low Voltage, High Frequency Inverters, OR’ing,
and Polarity Protection Applications
A2
b1
b2
D
·
·
·
·
High Forward Surge Current Capability
L1
Lead Free Finish, RoHS Compliant (Note 1)
"Green" Molding Compound (No Br, Sb)
Qualified to AEC-Q101 Standards for High Reliability
e
BOTTOMSIDE
A2
b1
b1
HEAT SINK
D
D2
E
3.05 NOM
D2
b2
Mechanical Data
6.40
6.60
L
e
1.84 NOM
·
·
Case: PowerDIä5
E2
E
E1
E2
L
5.30
5.45
Case Material: Molded Plastic, “Green” Molding
Compound. UL Flammability Classification Rating 94V-0
3.55 NOM
W
L1
·
·
Moisture Sensitivity: Level 1 per J-STD-020C
0.75
0.50
1.20
0.95
0.65
1.50
Terminals: Finish – Matte Tin annealed over Copper
leadframe. Solderable per MIL-STD-202, Method 208
e
L1
W
e
3
b1
b1
·
·
·
Polarity: See Diagram
LEFT PIN
All Dimensions in mm
BOTTOMSIDE
HEAT SINK
Marking: See Page 3
RIGHT PIN
Weight: 0.096 grams (approx.)
TOP VIEW
@ TA = 25°C unless otherwise specified
Maximum Ratings
Single phase, half wave, 60Hz, resistive or inductive load.
For capacitive load, derate current by 20%.
Value
40
Characteristic
Symbol
Unit
VRRM
VRWM
VR
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
V
VR(RMS)
RMS Reverse Voltage
28
V
A
Average Rectified Output Current (See also Figure 5)
per element
total device
5
10
IO
Non-Repetitive Peak Forward Surge Current
8.3ms Single half sine-wave Superimposed on Rated Load
Per element
IFSM
110
A
Tj
Operating Temperature Range
Storage Temperature Range
-65 to +150
-65 to +150
°C
TSTG
°C
@ TA = 25°C unless otherwise specified
Thermal Characteristics
Characteristic
Symbol
Typ
¾
Max
2.0
¾
Unit
°C/W
°C/W
°C/W
°C/W
RqJS
RqJA
RqJA
RqJA
Thermal Resistance Junction to Soldering Point
Thermal Resistance Junction to Ambient Air (Note 2)
Thermal Resistance Junction to Ambient Air (Note 3)
Thermal Resistance Junction to Ambient Air (Note 4)
95
75
50
¾
¾
Notes:
1. RoHS revision 13.2.2003. Glass and High Temperature Solder Exemptions Applied, see EU Directive Annex Notes 5 and 7.
2. FR-4 PCB, 2 oz. Copper, minimum recommended pad layout per http://www.diodes.com/datasheets/ap02001.pdf.
3. Polyimide PCB, 2 oz. Copper, minimum recommended pad layout per http://www.diodes.com/datasheets/ap02001.pdf.
4. Polyimide PCB, 2 oz. Copper. Cathode pad dimensions 9.4mm x 7.2mm. Anode pad dimensions 2.7mm x 1.6mm.
DS30485 Rev. 8 - 2
1 of 3
PDS1040CTL
PowerDI is a trademark of Diodes Incorporated.
www.diodes.com
ã Diodes Incorporated