SPICE MODEL: PDS1040L
PDS1040L
10A LOW VF SCHOTTKY BARRIER RECTIFIER
PowerDI ä5
Features
·
Guard Ring Die Construction for
Transient Protection
A
D
b2
·
·
·
Very Low Forward Voltage Drop
High Forward Surge Current Capability
A2
L1
ä
PowerDI 5
For Use in Low Voltage, High Frequency Inverters, Free
Wheeling, and Polarity Protection Applications
Min
1.05
0.33
0.80
1.70
3.90
Max
1.15
0.43
0.99
1.88
4.05
Dim
A
E
E1
·
·
·
Lead Free Finish, RoHS Compliant (Note 1)
"Green" Molding Compound (No Br, Sb)
A2
b1
b2
D
L1
e
Qualified to AEC-Q101 Standards for High Reliability
A2
b1
b1
D
D2
b2
Mechanical Data
D2
E
3.05 NOM
L
·
·
Case: PowerDIä5
6.40
6.60
E2
e
1.84 NOM
E
Case Material: Molded Plastic, “Green” Molding
Compound. UL Flammability Classification Rating 94V-0
E1
E2
L
5.30
5.45
W
L1
·
·
Moisture sensitivity: Level 1 per J-STD-020C
3.55 NOM
Terminals: Finish – Matte Tin annealed over Copper
e
0.75
0.50
1.20
0.95
0.65
1.50
e
3
leadframe. Solderable per MIL-STD-202, Method 208
b1
b1
L1
W
·
·
·
Polarity: See Diagram
LEFT PIN
RIGHT PIN
BOTTOMSIDE
HEAT SINK
Marking: See Page 3
All Dimensions in mm
Weight: 0.096 grams (approx.)
Note: Pins Left & Right must
be electrically connected
at the printed circuit board.
@ TA = 25°C unless otherwise specified
Maximum Ratings
Single phase, half wave, 60Hz, resistive or inductive load.
For capacitive load, derate current by 20%.
Value
Characteristic
Symbol
Unit
VRRM
VRWM
VR
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
40
V
VR(RMS)
IO
RMS Reverse Voltage
28
10
V
A
Average Rectified Output Current (see also Figure 5)
Non-Repetitive Peak Forward Surge Current
8.3ms Single half sine-wave Superimposed on Rated Load
IFSM
275
A
Operating Junction Temperature Range
Storage Temperature Range
VR £ 80% VRRM
VR £ 50% VRRM
-65 to +130
-65 to +150
TJ
°C
°C
TSTG
-65 to +150
@ TA = 25°C unless otherwise specified
Thermal Characteristics
Characteristic
Symbol
Typ
¾
Max
1.5
¾
Unit
°C/W
°C/W
°C/W
°C/W
RqJS
RqJA
RqJA
RqJA
Thermal Resistance Junction to Soldering Point
Thermal Resistance Junction to Ambient Air (Note 2)
Thermal Resistance Junction to Ambient Air (Note 3)
Thermal Resistance Junction to Ambient Air (Note 4)
85
65
50
¾
¾
Notes:
1. RoHS revision 13.2.2003. Glass and High Temperature Solder Exemptions Applied, see EU Directive Annex Notes 5 and 7.
2. FR-4 PCB, 2 oz. Copper, minimum recommended pad layout per http://www.diodes.com/datasheets/ap02001.pdf.
3. Polymide PCB, 2 oz. Copper, minimum recommended pad layout per http://www.diodes.com/datasheets/ap02001.pdf.
4. Polymide PCB, 2 oz. Copper. Cathode pad dimensions 9.4mm x 7.2mm. Anode pad dimensions 2.7mm x 1.6mm.
DS30486 Rev. 8 - 2
1 of 3
PDS1040L
PowerDI is a trademark of Diodes Incorporated.
www.diodes.com
ã Diodes Incorporated