Datasheet > PC93-30-30-1

PC93-30-30-1

更新时间： 2024-11-29 22:55:55

品牌	Logo	应用领域
其他 - ETC		/
页数	文件大小	规格书
2页	681K
描述
THERM PAD 30MMX30MM GRAY

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PC93-30-30-1 数据手册

PC93

Non-Silicone Thermal Conductive Pad

Version 2.160819

Non-Silicone Thermal Conductive Pad

PC93 is a soft, non-silicone thermal interface pad designed to replace traditional

thermal pads in silicone-sensitive applications. Typical uses include, set-top boxes,

optical and automotive projects. PC93 can be provided in a range of different

thicknesses and formats depending on the end use.

Features

Low contact thermal impedance

Good thermal conductivity

Silicone free

Long term stability

Applications

Electronic components: IC, CPU, MOS

LED, M/B, P/S, Heat Sink

LCD TV, Notebook PC, PC Telecom Device, Wireless Hub, etc.

DDR II Module, DVD Applications, Hand-set applications, etc.

Properties

REACH Compliant

ROHS Compliant

Property

PC93

Grey

Unit

Tolerance Test Method

Colour

Visual

0.50 - 5.0

0.0197 - 0.1969

inch

ASTM D374

Thickness (Available thick-

ness range)

Thermal Conductivity

Flammability Rating

2.1

W/mK

10ꢀ

ASTM D5470

UL 94

V-0

Dielectric Breakdown Voltage

Weight Loss

10.2

kV/mm

ꢀ

ASTM D149

ASTM E595

ASTM D792

‹1

Density

2.1

g/cm³

˚C

0.2

Working Temperature

Volume Resistance

Elongation

-30 to +125

›10¹⁰

350

Ohm-cm

ꢀ

ASTM D257

ASTM D412

ASTM D2240

Tensile Strength

Hardness

Kgf/mm²

Shore 00

Thermal Impedance vs Pressure vs Deﬂection

Pressure (psi)

R(°C-in²/W)

1.01

Deﬂection (%)

T-Global Technology Limited

1 & 2 Cosford Business Park, Central Park,

Lutterworth, Leicestershire LE17 4QU U.K.

0.95

0.74

Tel: +44 (0)1455 553 510

Email: sales@tglobaltechnology.com

Web: www.tglobaltechnology.com

VAT #: GB 116 662 714

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